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MTP29N15E

Onsemi

MTP29N15E by Onsemi

MTP29N15E by Onsemi is a N-CHANNEL Power FET with 150V DS Breakdown Voltage and 102A IDM. Ideal for SWITCHING applications, it features a single configuration with built-in diode and 0.07 ohm Drain-Source On Resistance. Operating in ENHANCEMENT MODE, this transistor has a max power dissipation of 125W and can handle up to 29A drain current.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,596 parts In-Stock

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Vyrian

USA . 353 parts In-Stock

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Advanced Electronics

New Zealand . 530 parts In-Stock

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$0.381

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$0.377

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$0.362

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530

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Kepictronics

USA . 13,000 parts In-Stock

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TANS Electronics

Latvia . 7,085 parts In-Stock

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Kulean Microsystems

USA . 6,401 parts In-Stock

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SupplyDigital Components

Austria . 5,632 parts In-Stock

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Corphita

USA . 1,991 parts In-Stock

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UHIMA Technologies

Türkiye . 805 parts In-Stock

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Problanco Electronics

Mexico . 399 parts In-Stock

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Corohmni

South Africa . 134 parts In-Stock

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Overview

Power up your projects with the MTP29N15E by Onsemi! This high-quality Power Field Effect Transistor (FET) offers unparalleled performance and reliability for all your switching applications. With a maximum pulse drain current of 102A and an avalanche energy rating of 421mJ, this N-channel transistor is a powerhouse in a compact rectangular package. Whether you're working on industrial equipment, automotive electronics, or power supplies, the MTP29N15E delivers exceptional value and efficiency. Trust Onsemi's expertise and innovation to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good mechanical strength and thermal conductivity, making the product durable and efficient in heat dissipation.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally have better conductance and efficiency compared to P-Channel FETs, making this product suitable for high-performance applications.

Minimum DS Breakdown Voltage: 150 V

With a high breakdown voltage, this FET can handle high voltages and is suitable for applications where voltage spikes may occur.

Maximum Drain-Source On Resistance: 0.07 ohm

Low on-resistance results in less power loss and heat generation, making this FET efficient for switching applications.

Maximum Power Dissipation (Abs): 125 W

With a high power dissipation rating, this FET can handle high power loads without overheating, ensuring reliable operation.

Technical Specifications

Power Field Effect Transistors (FET) MTP29N15E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

421 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

29 A

Maximum Drain Current (ID):

29 A

Maximum Drain-Source On Resistance:

.07 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

102 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTP29N15E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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