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MTP2P50EG

Onsemi

MTP2P50EG by Onsemi

MTP2P50EG by Onsemi is a P-CHANNEL Power FET with 500V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 6A and EAS of 80mJ, operating in ENHANCEMENT MODE. With a package style of FLANGE MOUNT and SILICON element material, it offers reliable performance up to 150°C.

Median Price

$7.164

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.827

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100

$1.827

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Vyrian

USA . 5,672 parts In-Stock

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5,672

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Digiode

USA . 1,182 parts In-Stock

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1,182

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Chip Stock

USA . 865 parts In-Stock

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865

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ComSIT Distribution GmbH

Germany . 23 parts In-Stock

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23

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Component Sense

UK . 4 parts In-Stock

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$12.502

4

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$12.502

Distributors (Availability)

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Continental Prestige Electronics

USA . 6,569 parts In-Stock

1+ parts

$1.143

100+ parts

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$1.120

6,569

$1.143

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$1.120

Argo Parts USA

USA . 4,903 parts In-Stock

1+ parts

$1.143

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4,903

$1.143

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Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$1.483

100+ parts

$1.350

1k+ parts

$1.216

10k+ parts

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150

$1.483

$1.350

$1.216

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Corohmni

South Africa . 468 parts In-Stock

1+ parts

$1.790

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468

$1.790

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.827

100+ parts

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$1.735

10k+ parts

$1.699

1,000

$1.827

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$1.735

$1.699

AZTECH Wire

Italy . 570 parts In-Stock

1+ parts

$8.872

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570

$8.872

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Ampacity Inc.

Singapore . 651 parts In-Stock

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$25.050

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651

$25.050

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Lixinc

USA . 13,920 parts In-Stock

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Kepictronics

USA . 13,000 parts In-Stock

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Perfect Parts

USA . 10,506 parts In-Stock

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Kulean Microsystems

USA . 5,452 parts In-Stock

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TANS Electronics

Latvia . 3,700 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 2,480 parts In-Stock

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2,480

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UHIMA Technologies

Türkiye . 733 parts In-Stock

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733

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Problanco Electronics

Mexico . 699 parts In-Stock

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699

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SupplyDigital Components

Austria . 483 parts In-Stock

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483

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A-Z Elektronik GmbH

Germany . 209 parts In-Stock

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Overview

Enhance your electronic devices with the MTP2P50EG power field effect transistor from Onsemi. With a durable plastic/epoxy package and P-channel configuration, this transistor is perfect for switching applications. Boasting a minimum DS breakdown voltage of 500V and maximum power dissipation of 75W, this transistor offers reliable performance and efficient operation. Whether you're designing amplifiers, power supplies, or motor controls, the MTP2P50EG provides the value and quality you need to bring your projects to life. Upgrade your circuits with the trusted technology of Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material helps in reducing the overall weight and cost of the product, making it a cost-effective and lightweight option.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their high input impedance and lower input capacitance, making them suitable for high-frequency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse current flow, increasing the reliability and efficiency of the device.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers fast switching speeds and low on-state resistance, making it suitable for high-performance switching circuits.

Minimum DS Breakdown Voltage: 500 V

With a high breakdown voltage of 500V, this FET can withstand high voltage applications, ensuring reliable operation under challenging conditions.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy mounting and integration into circuit designs, enhancing the overall functionality of the product.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide a strong and reliable connection to the circuit board, ensuring stable performance even in demanding environments.

Operating Mode: ENHANCEMENT MODE

Being an enhancement mode FET means that it can be easily controlled with a positive voltage, offering ease of use in various applications.

Maximum Pulsed Drain Current (IDM): 6 A

With a high maximum pulsed drain current of 6A, this FET can handle sudden surges in current, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 80 mJ

The high avalanche energy rating of 80mJ ensures protection against voltage spikes and surges, enhancing the reliability of the device.

Technical Specifications

Power Field Effect Transistors (FET) MTP2P50EG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

HIGH VOLTAGE

Avalanche Energy Rating (EAS):

80 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

6 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTP2P50EG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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