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MPSW01ARL1

Onsemi

MPSW01ARL1 by Onsemi

MPSW01ARL1 by Onsemi is a NPN BJT with hFE of 50, VCEO of 40V, and IC of 1A. Ideal for low-power applications in electronics due to its high transition frequency of 50MHz. Its through-hole package makes it suitable for various circuit designs requiring a single NPN transistor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,136 parts In-Stock

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Digiode

USA . 703 parts In-Stock

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Corphita

USA . 2,149 parts In-Stock

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Problanco Electronics

Mexico . 2,088 parts In-Stock

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TANS Electronics

Latvia . 1,010 parts In-Stock

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SupplyDigital Components

Austria . 418 parts In-Stock

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Kulean Microsystems

USA . 339 parts In-Stock

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Corohmni

South Africa . 148 parts In-Stock

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UHIMA Technologies

Türkiye . 62 parts In-Stock

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Overview

Upgrade your electronic projects with the MPSW01ARL1 from Onsemi, a top-quality Small Signal Bipolar Junction Transistor. With its NPN configuration and high DC current gain, this transistor offers superior performance and reliability. Ideal for a wide range of applications, this product is perfect for amplification, switching, and signal processing in electronic circuits. Trust in Onsemi's reputation for excellence and choose the MPSW01ARL1 for all your semiconductor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material provides durability and helps in reducing the overall weight of the product.

Polarity or Channel Type: NPN

NPN type transistors are commonly used in amplifier circuits, making this product versatile and suitable for various applications.

Configuration: SINGLE

Single configuration simplifies circuit design and makes the product easy to integrate into existing systems.

Package Shape: ROUND

Round shape allows for easy mounting and placement in circuit boards, saving space and enabling efficient circuit layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure secure connections and facilitate easy soldering during assembly.

No. of Terminals: 3

With 3 terminals, this transistor can be easily integrated into circuits and provides necessary connections for proper functioning.

Package Style (Meter): CYLINDRICAL

Cylindrical package style provides a compact form factor, making the product suitable for applications with limited space constraints.

Minimum DC Current Gain (hFE): 50

A minimum DC current gain of 50 ensures reliable amplification and signal processing capabilities of the transistor.

Maximum Operating Temperature: 150 °C

High maximum operating temperature of 150 °C allows the product to withstand harsh environmental conditions and ensures long-term stability.

Maximum Collector-Emitter Voltage: 40 V

High maximum collector-emitter voltage rating of 40V provides protection against voltage spikes and overloads in the circuit.

Transistor Element Material: SILICON

Silicon transistor element material offers high performance, reliability, and efficiency, making this product a durable and long-lasting choice.

Maximum Collector Current (IC): 1 A

With a maximum collector current of 1A, this transistor can handle moderate power levels and is suitable for a wide range of applications.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures proper conductivity and solderability, making the product easy to integrate into circuit boards during assembly.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy mounting and connection to external components in the circuit.

Nominal Transition Frequency (fT): 50 MHz

Nominal transition frequency of 50MHz indicates high-speed switching capabilities, making the transistor suitable for applications requiring fast response times.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) MPSW01ARL1 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Maximum Collector Current (IC):

1 A

Maximum Collector-Emitter Voltage:

40 V

Configuration:

Minimum DC Current Gain (hFE):

50

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

CYLINDRICAL

Polarity or Channel Type:

NPN

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

BOTTOM

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MPSW01ARL1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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