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MJ11029G

Onsemi

MJ11029G by Onsemi

The Onsemi MJ11029G is a PNP power BJT with Darlington configuration, ideal for amplifier applications. It offers a max collector current of 50A, min DC current gain of 400 (hFE), and max power dissipation of 300W. With a max operating temp of 200 °C and Vce of 60V, it features a metal package body suitable for flange mount installations.

Median Price

$2.513

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$2.240

1k+ parts

$2.010

10k+ parts

$1.890

350

-

$2.240

$2.010

$1.890

DigiKey

USA . 350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.950

10k+ parts

-

350

-

-

$2.950

-

Verical

USA . 350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.513

10k+ parts

$2.362

350

-

-

$2.513

$2.362

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 55 parts In-Stock

1+ parts

$2.375

100+ parts

-

1k+ parts

-

10k+ parts

-

55

$2.375

-

-

-

Vyrian

USA . 6,352 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,352

-

-

-

-

DigiKey Marketplace

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$2.600

1k+ parts

-

10k+ parts

-

350

-

$2.600

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 176 parts In-Stock

1+ parts

$2.060

100+ parts

-

1k+ parts

-

10k+ parts

-

176

$2.060

-

-

-

Corphita

USA . 1,662 parts In-Stock

1+ parts

$2.250

100+ parts

-

1k+ parts

-

10k+ parts

-

1,662

$2.250

-

-

-

Microchip USA

USA . 7,377 parts In-Stock

1+ parts

$15.600

100+ parts

-

1k+ parts

-

10k+ parts

-

7,377

$15.600

-

-

-

Kulean Microsystems

USA . 7,423 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,423

-

-

-

-

SupplyDigital Components

Austria . 5,120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,120

-

-

-

-

TANS Electronics

Latvia . 790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

790

-

-

-

-

UHIMA Technologies

Türkiye . 356 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

356

-

-

-

-

Continental Prestige Electronics

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$2.060

1k+ parts

-

10k+ parts

-

350

-

$2.060

-

-

Problanco Electronics

Mexico . 346 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

346

-

-

-

-

Overview

Upgrade your electronics with the MJ11029G by Onsemi, a top-tier manufacturer known for delivering high-quality Power Bipolar Junction Transistors. This PNP transistor is perfect for amplifier applications, offering a maximum power dissipation of 300W and a minimum DC current gain of 400. With a maximum collector-emitter voltage of 60V and a maximum collector current of 50A, this transistor provides reliable performance in a variety of settings. Trust Onsemi to deliver cutting-edge technology that enhances your projects and brings value to your work.

Feature Benefit Bullets

Package Body Material: METAL

The use of metal for the package body provides excellent thermal conductivity, allowing for efficient heat dissipation and helping to prevent overheating during operation.

Polarity or Channel Type: PNP

The PNP configuration makes this transistor suitable for applications where a positive voltage is required at the base to turn it on, providing versatility for various circuit designs.

Configuration: DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

The Darlington configuration offers high current gain, while the built-in diode and resistor simplify circuit design by providing additional components in one package.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor is well-suited for amplifying signals and controlling power output with high efficiency.

Package Shape: ROUND

The round package shape allows for easy installation and mounting in various applications, providing flexibility and convenience in circuit design.

No. of Terminals: 2

With only 2 terminals, this transistor is simple to connect and integrate into a circuit, reducing complexity and potential points of failure.

Maximum Power Dissipation (Abs): 300 W

The high maximum power dissipation capability of 300W ensures the transistor can handle heavy loads and operate reliably in demanding conditions.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure and stable mounting of the transistor, ensuring proper heat dissipation and electrical connections.

Minimum DC Current Gain (hFE): 400

With a minimum DC current gain of 400, this transistor provides consistent and reliable amplification of input signals, ideal for high-gain applications.

Maximum Operating Temperature: 200 °C

The high maximum operating temperature of 200 °C allows the transistor to function effectively even in hot environments, making it suitable for a wide range of applications.

Maximum Collector-Emitter Voltage: 60 V

The maximum collector-emitter voltage of 60V ensures that the transistor can safely handle higher voltage levels, providing protection against overvoltage conditions.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its reliability and robust performance, making this transistor a durable and long-lasting component.

Maximum Collector Current (IC): 50 A

With a high maximum collector current of 50A, this transistor can handle heavy current loads with ease, making it suitable for power applications that require high current output.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections and long-term performance.

Terminal Position: BOTTOM

The bottom terminal position makes it easy to connect and solder the transistor to a circuit board, facilitating quick and secure installation.

Case Connection: COLLECTOR

The case connection at the collector terminal simplifies the circuit layout and allows for efficient heat dissipation, contributing to the overall reliability and performance of the transistor.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C ensures that the transistor can withstand the soldering process without damage, making it easy to integrate into a circuit during manufacturing.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJ11029G attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

60 V

Minimum DC Current Gain (hFE):

400

JEDEC-95 Code:

TO-204AA

JESD-30 Code:

O-MBFM-P2

JESD-609 Code:

e1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

200 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

PNP

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

PIN/PEG

Terminal Position:

BOTTOM

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MJ11029G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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