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MJ11022

Onsemi

MJ11022 by Onsemi

MJ11022 by Onsemi is a NPN BJT with 175W power dissipation, 250V max collector-emitter voltage, and 15A max collector current. Ideal for switching applications due to its Darlington configuration with built-in diode and resistor. Package style is flange mount with round shape and pin/peg terminals.

Median Price

$10.080

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 3,549 parts In-Stock

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$10.080

100+ parts

$6.048

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$5.796

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3,549

$10.080

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Digiode

USA . 1,556 parts In-Stock

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Vyrian

USA . 1,265 parts In-Stock

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ES Components

USA . 177 parts In-Stock

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PAR Electronics

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ACDS - Activité Composants Distribution Service

France . 27 parts In-Stock

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Electronics Depot

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Fibra_Brandt Electronic GMBH

Germany . 10 parts In-Stock

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LittleDiode

UK . 4 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 2 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 20,508 parts In-Stock

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Problanco Electronics

Mexico . 8,080 parts In-Stock

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SupplyDigital Components

Austria . 5,677 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,663 parts In-Stock

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Kulean Microsystems

USA . 5,083 parts In-Stock

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TANS Electronics

Latvia . 2,814 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 825 parts In-Stock

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Assy Fe

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Corohmni

South Africa . 304 parts In-Stock

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Perfect Parts

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Overview

Enhance your electronic projects with the MJ11022 by Onsemi, a high-quality Power BJT transistor that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this NPN Darlington transistor is perfect for switching applications. With a maximum power dissipation of 175W and a collector current of 15A, this transistor provides unmatched value and benefits to customers looking for efficient and effective solutions. Upgrade your designs with the MJ11022 and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: METAL

The use of metal body material enhances the durability and ruggedness of the transistor, making it suitable for rugged industrial applications.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplification and switching circuits, providing versatility and compatibility with a wide range of applications.

Configuration: DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

The Darlington configuration offers high current gain, while the built-in diode and resistor simplify circuit design and save space, making this transistor convenient for compact designs.

Transistor Application: SWITCHING

Designed for switching applications, this transistor offers fast switching speeds and high efficiency, making it ideal for power control and modulation.

Maximum Power Dissipation: 175 W

With a high maximum power dissipation rating, this transistor can handle high power levels without overheating, ensuring reliable performance under heavy loads.

Maximum Collector-Emitter Voltage: 250 V

The high collector-emitter voltage rating allows this transistor to handle high voltage applications, providing versatility and compatibility with a wide range of circuits.

Maximum Collector Current: 15 A

Capable of handling high collector currents, this transistor is suitable for power switching applications that require high current capabilities.

Nominal Transition Frequency: 3 MHz

With a high transition frequency, this transistor can operate at high frequencies, making it suitable for high-speed switching applications and RF amplification.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJ11022 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

250 V

Minimum DC Current Gain (hFE):

100

JEDEC-95 Code:

TO-204AA

JESD-30 Code:

O-MBFM-P2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

PIN/PEG

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

MJ11022 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

NSN

5961-01-315-3265, 5961013153265

NIIN

013153265

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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