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MJ11028

Onsemi

MJ11028 by Onsemi

MJ11028 by Onsemi is a NPN BJT with 300W power dissipation, 60V max collector-emitter voltage, and 50A max collector current. Ideal for amplifier applications due to its Darlington configuration with built-in diode and resistor. Package style is flange mount with round shape and metal body material.

Median Price

$12.984

Lifecycle Status

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19

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Master Electronics

USA . 8 parts In-Stock

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$11.290

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$10.120

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Verical

USA . 5 parts In-Stock

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$14.677

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$13.871

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DigiKey Marketplace

USA . 499 parts In-Stock

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$13.440

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American Microsemiconductor Inc.

USA . 391 parts In-Stock

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Vyrian

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Digiode

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Bristol Electronics

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ComSIT Distribution GmbH

Germany . 22 parts In-Stock

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Electronic Expediters

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ECAB

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Connector Distribution Corp

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Right Parts Inc.

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Electro Sonic

Canada . 8 parts In-Stock

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$11.630

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$10.420

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Corel Iberica Componentes, S.L.

Spain . 3 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Manoshevitz Elec. Sales

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Digital Electronic Gebert Verwaltungs UG

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MISTER SPROCKETS

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Benley Electronics

USA . 3 parts In-Stock

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$0.650

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Component Stockers USA

USA . 7,757 parts In-Stock

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$5.400

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$5.130

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$4.970

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Corohmni

South Africa . 478 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Problanco Electronics

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Microchip USA

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Kulean Microsystems

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Corphita

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TANS Electronics

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IDEA Electronic Components Group

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Parana Technologies

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UHIMA Technologies

Türkiye . 188 parts In-Stock

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MKK Technologies

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DigiPath Technology Company

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Overview

Power up your projects with the reliable performance of the MJ11028 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality power bipolar junction transistors that are ideal for amplifier applications. With a maximum power dissipation of 300W and a minimum DC current gain of 400, this NPN transistor is designed for efficiency and durability. The MJ11028 also features a built-in diode and resistor, offering added convenience for your projects. Trust Onsemi to provide you with exceptional products that deliver high performance and reliability every time. Elevate your designs with the MJ11028 today.

Feature Benefit Bullets

Package Body Material: METAL

Metal packages provide good thermal performance, ensuring efficient heat dissipation during operation.

Polarity or Channel Type: NPN

NPN transistors are commonly used in amplifiers and switching circuits, making this product versatile for different applications.

Configuration: DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

The Darlington configuration provides high current gain and the built-in diode and resistor offer convenience for circuit design.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance in amplifying signals.

Package Shape: ROUND

Round package shape allows for compact and space-saving designs in electronic circuits.

Maximum Power Dissipation (Abs): 300 W

High maximum power dissipation allows for handling large amounts of power, making this transistor suitable for power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides easy mounting and installation in electronic systems.

Minimum DC Current Gain (hFE): 400

High DC current gain ensures efficient signal amplification and overall performance of the transistor.

Maximum Operating Temperature: 200 °C

High maximum operating temperature allows for reliable performance in various environmental conditions.

Maximum Collector-Emitter Voltage: 60 V

The high maximum collector-emitter voltage ensures safe operation within specified voltage limits.

Transistor Element Material: SILICON

Silicon material offers high reliability, low leakage, and consistent performance characteristics.

Maximum Collector Current (IC): 50 A

High maximum collector current rating enables the transistor to handle high current loads without compromising performance.

Terminal Finish: Tin/Lead (Sn80Pb20)

Tin/Lead terminal finish provides good solderability and ensures reliable electrical connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB mounting and ensures proper alignment in electronic circuits.

Case Connection: COLLECTOR

Collector case connection simplifies circuit design and allows for efficient heat dissipation.

Maximum Time At Peak Reflow Temperature (s): 30

Short peak reflow time minimizes the risk of thermal damage during soldering process.

Peak Reflow Temperature °C: 235

High peak reflow temperature ensures reliable solder connections and proper bonding to PCB.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJ11028 attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

60 V

Minimum DC Current Gain (hFE):

400

JEDEC-95 Code:

TO-204AA

JESD-30 Code:

O-MBFM-P2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

200 Cel

Package Body Material:

METAL

Package Shape:

ROUND

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

PIN/PEG

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MJ11028 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-259-3796, 5961012593796

NIIN

012593796

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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