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MGP15N35CL

Onsemi

MGP15N35CL by Onsemi

MGP15N35CL by Onsemi is an N-CHANNEL IGBT with 380V max collector-emitter voltage, 15A max collector current, and 136W max power dissipation. It is designed for automotive ignition applications due to its built-in diode and resistor. The transistor has a turn-off time of 20500ns and operates at a max temperature of 175 °C.

Median Price

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Lifecycle Status

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TANS Electronics

Latvia . 5,742 parts In-Stock

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Kulean Microsystems

USA . 3,131 parts In-Stock

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Problanco Electronics

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UHIMA Technologies

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Corphita

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SupplyDigital Components

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Overview

Enhance the performance of your automotive ignition systems with the MGP15N35CL by Onsemi. Crafted with precision and expertise, this Insulated Gate Bipolar Transistor (IGBT) offers exceptional quality and reliability. Designed for N-channel applications, this single transistor comes with a built-in diode and resistor, providing convenience and efficiency. With a maximum collector-emitter voltage of 380V and a nominal turn-off time of 20500ns, the MGP15N35CL ensures optimal power dissipation and temperature regulation. Trust Onsemi to deliver innovative solutions for your automotive needs. Elevate your ignition system with the MGP15N35CL from Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliability.

Polarity or Channel Type: N-CHANNEL

Offers high efficiency and superior performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

Simplifies circuit design and reduces the need for additional components, saving space and cost.

Transistor Application: AUTOMOTIVE IGNITION

Specifically designed for automotive ignition systems, ensuring reliable and efficient performance in demanding environments.

Maximum Power Dissipation (Abs): 136 W

Can handle high power levels without overheating, making it suitable for heavy-duty applications.

Maximum Operating Temperature: 175 °C

Can operate in high temperature environments without compromising performance, ideal for automotive applications.

Maximum Collector-Emitter Voltage: 380 V

Can handle high voltage levels, providing versatility in various applications.

Maximum Collector Current (IC): 15 A

Capable of handling high current levels, suitable for applications requiring high power output.

Maximum Gate-Emitter Threshold Voltage: 2.1 V

Provides precise control over the switching operation, ensuring fast and efficient performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) MGP15N35CL attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

VOLTAGE CLAMPING

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

380 V

Maximum Gate-Emitter Threshold Voltage:

2.1 V

Maximum Gate-Emitter Voltage:

22 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

AUTOMOTIVE IGNITION

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

20500 ns

Nominal Turn On Time (ton):

6000 ns

Trade Compliance

MGP15N35CL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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