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MGP11N60E

Onsemi

MGP11N60E by Onsemi

MGP11N60E by Onsemi is an N-CHANNEL IGBT transistor with a max collector-emitter voltage of 600V and a max collector current of 15A. It is designed for motor control applications, featuring a nominal turn-off time of 442ns and a max power dissipation of 96W.

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Vyrian

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Digiode

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Kulean Microsystems

USA . 4,179 parts In-Stock

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SupplyDigital Components

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TANS Electronics

Latvia . 2,897 parts In-Stock

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Corphita

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UHIMA Technologies

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Problanco Electronics

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Corohmni

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Overview

Unleash the power of your electronic devices with the MGP11N60E by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. This Insulated Gate Bipolar Transistor (IGBT) is perfect for motor control applications, offering seamless performance and efficiency. With a single configuration and built-in diode, this transistor ensures smooth operation and maximum power dissipation. Trust Onsemi to deliver cutting-edge technology that exceeds your expectations. Elevate your projects with the MGP11N60E and experience unparalleled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the IGBT, allowing for easy installation and long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher efficiency, making them a good choice for motor control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps protect the circuit from voltage spikes and allows for simpler circuit design.

Transistor Application: MOTOR CONTROL

Specifically designed for motor control applications, ensuring optimal performance and efficiency in driving motors.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to mount and secure the IGBT in place.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection to the circuit board.

Nominal Turn Off Time (toff): 442 ns

Fast turn off time allows for efficient switching and control of the motor, reducing power losses.

Maximum Power Dissipation (Abs): 96 W

High power dissipation capability ensures the IGBT can handle high load conditions without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for easy integration into existing systems and provides a secure mounting option.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this IGBT can withstand harsh environmental conditions.

Maximum Collector-Emitter Voltage: 600 V

High maximum voltage rating allows for use in a wide range of industrial and commercial applications.

Transistor Element Material: SILICON

Silicon-based IGBTs offer high reliability and performance, making them a popular choice for power electronics.

Maximum Gate-Emitter Voltage: 20 V

Safe operating voltage range for the gate-emitter voltage, ensuring reliable and stable operation.

Maximum Collector Current (IC): 15 A

High collector current rating allows the IGBT to handle large current loads, making it suitable for motor control applications.

Maximum Gate-Emitter Threshold Voltage: 8 V

Low gate-emitter threshold voltage ensures the IGBT can be easily switched on and off, improving efficiency.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and ensures a reliable electrical connection.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection to the circuit board.

Case Connection: COLLECTOR

Collector case connection allows for efficient heat dissipation and helps maintain the IGBT's temperature within safe limits.

Nominal Turn On Time (ton): 68 ns

Fast turn on time ensures quick response and precise control over the motor, improving overall system performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) MGP11N60E attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

ULTRAFAST, HIGH SPEED

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

8 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

MOTOR CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

442 ns

Nominal Turn On Time (ton):

68 ns

Trade Compliance

MGP11N60E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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