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MC74HC86AFELG

Onsemi

MC74HC86AFELG by Onsemi

MC74HC86AFELG by Onsemi is a CMOS Logic Gates IC with 4 functions, 2 inputs, and 31ns propagation delay. It operates at -55 to 125 °C and has a supply voltage range of 2-6V. Ideal for military-grade applications requiring fast logic operations in compact designs.

Median Price

$0.305

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,000 parts In-Stock

1+ parts

-

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$0.317

1k+ parts

$0.263

10k+ parts

$0.235

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-

$0.317

$0.263

$0.235

Verical

USA . 12,000 parts In-Stock

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$0.293

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$0.293

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Digiode

USA . 61 parts In-Stock

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$0.247

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61

$0.247

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Vyrian

USA . 3,693 parts In-Stock

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R&J Components

USA . 2,000 parts In-Stock

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Corphita

USA . 889 parts In-Stock

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$0.234

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889

$0.234

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Corohmni

South Africa . 367 parts In-Stock

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$0.260

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367

$0.260

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AZTECH Wire

Italy . 51 parts In-Stock

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$8.580

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51

$8.580

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Continental Prestige Electronics

USA . 12,000 parts In-Stock

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$0.226

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$0.226

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Kulean Microsystems

USA . 6,639 parts In-Stock

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Problanco Electronics

Mexico . 5,475 parts In-Stock

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SupplyDigital Components

Austria . 3,187 parts In-Stock

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TANS Electronics

Latvia . 2,216 parts In-Stock

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UHIMA Technologies

Türkiye . 139 parts In-Stock

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Microchip USA

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Overview

Discover the cutting-edge MC74HC86AFELG logic gates by Onsemi, offering unparalleled quality and reliability. Perfect for a wide range of applications, these logic gates feature advanced technology and a MILITARY-grade temperature grade. With fast propagation delay and dual terminal position, these logic gates provide efficient performance and seamless integration. Trust Onsemi to deliver top-notch products that exceed expectations, providing value and benefits to customers seeking high-quality electronic components. Choose Onsemi for exceptional products that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection to the internal components of the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 31 ns

The low propagation delay ensures fast processing and response times, making this product suitable for high-speed applications.

Surface Mount: YES

The surface mount capability allows for easy and convenient placement on circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V makes the logic gates compatible with a wide range of digital systems and applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in challenging environmental conditions.

Technical Specifications

Logic Gates MC74HC86AFELG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

31 ns

Propagation Delay (tpd):

150 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.275 mm

Trade Compliance

MC74HC86AFELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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