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MC10H164FNR2G

Onsemi

MC10H164FNR2G by Onsemi

MC10H164FNR2G by Onsemi is an ECL multiplexer with 8 inputs, 2.5 ns propagation delay, and open-emitter output. It operates b/w 0-75 °C, has a terminal pitch of 1.27mm, and is suitable for high-speed data communication applications.

Median Price

$3.892

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,920 parts In-Stock

1+ parts

-

100+ parts

$3.460

1k+ parts

$3.090

10k+ parts

$2.910

3,920

-

$3.460

$3.090

$2.910

Verical

USA . 1,920 parts In-Stock

1+ parts

-

100+ parts

$4.325

1k+ parts

$3.862

10k+ parts

$3.638

1,920

-

$4.325

$3.862

$3.638

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 684 parts In-Stock

1+ parts

$3.648

100+ parts

-

1k+ parts

-

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684

$3.648

-

-

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Vyrian

USA . 4,634 parts In-Stock

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-

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4,634

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 88 parts In-Stock

1+ parts

$3.320

100+ parts

-

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88

$3.320

-

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Corphita

USA . 600 parts In-Stock

1+ parts

$3.456

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-

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600

$3.456

-

-

-

AZTECH Wire

Italy . 807 parts In-Stock

1+ parts

$21.880

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807

$21.880

-

-

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$36.975

100+ parts

$33.647

1k+ parts

$30.320

10k+ parts

-

2,000

$36.975

$33.647

$30.320

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QUARKTWIN TECHNOLOGY LTD

USA . 17,682 parts In-Stock

1+ parts

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17,682

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Microchip USA

USA . 6,193 parts In-Stock

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6,193

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Problanco Electronics

Mexico . 5,578 parts In-Stock

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5,578

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Continental Prestige Electronics

USA . 3,920 parts In-Stock

1+ parts

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100+ parts

$3.320

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3,920

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$3.320

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TANS Electronics

Latvia . 2,655 parts In-Stock

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2,655

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SupplyDigital Components

Austria . 1,495 parts In-Stock

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1,495

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Kulean Microsystems

USA . 791 parts In-Stock

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791

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UHIMA Technologies

Türkiye . 435 parts In-Stock

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435

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Overview

Discover the cutting-edge MC10H164FNR2G by Onsemi, a top-of-the-line Multiplexer & Demultiplexer that guarantees unparalleled performance and reliability. Crafted with precision using high-quality materials, this product offers lightning-fast propagation delay and a wide range of applications. With Onsemi's reputation for excellence in the industry, you can trust that this chip carrier package will exceed your expectations. Unlock a world of possibilities with the MC10H164FNR2G and experience seamless integration, superior output characteristics, and unmatched value. Elevate your projects with this state-of-the-art technology from Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product, making it a good choice for long-term use.

Propagation Delay At Nominal Supply: 2.6 ns

With a low propagation delay, this product provides fast and efficient signal processing, making it suitable for high-speed applications.

No. of Inputs: 8

Having 8 inputs allows for versatile connectivity options, making this multiplexer/demultiplexer suitable for a wide range of applications.

Surface Mount: YES

With surface mount capability, this product can be easily integrated into electronic circuit boards, making installation and maintenance convenient.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature tolerance makes this product suitable for use in various environmental conditions, enhancing its versatility.

Technical Specifications

Multiplexer & Demultiplexer MC10H164FNR2G attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

83 mA

Propagation Delay At Nominal Supply:

2.6 ns

Propagation Delay (tpd):

2.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.965 mm

Trade Compliance

MC10H164FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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