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MC10H164FNG

Onsemi

MC10H164FNG by Onsemi

MC10H164FNG by Onsemi is an ECL technology multiplexer with 8 inputs and 2.5 ns propagation delay. It operates b/w 0-75 °C, has a terminal pitch of 1.27 mm, and is suitable for high-speed data communication applications.

Median Price

$3.892

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11,269 parts In-Stock

1+ parts

-

100+ parts

$3.460

1k+ parts

$3.090

10k+ parts

$2.910

11,269

-

$3.460

$3.090

$2.910

Verical

USA . 3,580 parts In-Stock

1+ parts

-

100+ parts

$4.325

1k+ parts

$3.862

10k+ parts

$3.638

3,580

-

$4.325

$3.862

$3.638

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 776 parts In-Stock

1+ parts

$3.648

100+ parts

-

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776

$3.648

-

-

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Vyrian

USA . 3,828 parts In-Stock

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3,828

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 333 parts In-Stock

1+ parts

$3.320

100+ parts

-

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333

$3.320

-

-

-

Corphita

USA . 146 parts In-Stock

1+ parts

$3.456

100+ parts

-

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146

$3.456

-

-

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AZTECH Wire

Italy . 44 parts In-Stock

1+ parts

$18.920

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44

$18.920

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QUARKTWIN TECHNOLOGY LTD

USA . 27,994 parts In-Stock

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27,994

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Continental Prestige Electronics

USA . 11,269 parts In-Stock

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11,269

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Problanco Electronics

Mexico . 6,473 parts In-Stock

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6,473

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Microchip USA

USA . 5,091 parts In-Stock

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5,091

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Kulean Microsystems

USA . 4,694 parts In-Stock

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4,694

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SupplyDigital Components

Austria . 1,702 parts In-Stock

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1,702

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TANS Electronics

Latvia . 815 parts In-Stock

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815

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Perfect Parts

USA . 764 parts In-Stock

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764

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UHIMA Technologies

Türkiye . 205 parts In-Stock

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205

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Authorized Procurement Solutions

USA . 111 parts In-Stock

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111

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GreenTree Electronics

Israel . 111 parts In-Stock

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111

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Overview

Elevate your circuit design with the MC10H164FNG by Onsemi, a top-tier multiplexer & demultiplexer that delivers exceptional performance and reliability. Crafted by the renowned manufacturer Onsemi, this chip carrier package boasts a lightning-fast propagation delay of 2.5 ns, making it ideal for high-speed applications. With 8 inputs and open-emitter output characteristics, this versatile device offers unmatched precision and efficiency. Embrace the future of electronics with the MC10H164FNG and experience the cutting-edge technology that sets you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the multiplexer/demultiplexer, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 2.6 ns

Low propagation delay ensures fast and efficient data transmission within the multiplexer/demultiplexer, improving overall system response time.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

No. of Inputs: 8

Having 8 inputs allows for versatile connectivity options, enabling the multiplexer/demultiplexer to handle multiple input signals effectively.

Package Shape: SQUARE

Square package shape provides stability and ease of mounting, ensuring secure placement within the system design.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers compactness and efficient heat dissipation, making it suitable for high-density integration applications.

Maximum Operating Temperature: 75 °C

High maximum operating temperature tolerance ensures reliability and stability of the multiplexer/demultiplexer under varying environmental conditions.

Minimum Operating Temperature: 0 °C

Wide temperature range support allows for versatile usage in different temperature environments without compromising performance.

Terminal Finish: TIN

TIN terminal finish provides corrosion resistance and solderability, ensuring reliable electrical connections for the multiplexer/demultiplexer.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, making the multiplexer/demultiplexer suitable for high-performance computing applications.

Technical Specifications

Multiplexer & Demultiplexer MC10H164FNG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

83 mA

Propagation Delay At Nominal Supply:

2.6 ns

Propagation Delay (tpd):

2.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.965 mm

Trade Compliance

MC10H164FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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