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MC10H158PG

Onsemi

MC10H158PG by Onsemi

MC10H158PG by Onsemi is a 4-function, 2-input multiplexer with a propagation delay of 1.9 ns at 75 °C. It operates in commercial extended temperature range and uses ECL technology. Ideal for applications requiring fast signal switching in compact designs.

Median Price

$4.129

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,741 parts In-Stock

1+ parts

-

100+ parts

$3.670

1k+ parts

$3.280

10k+ parts

$3.090

6,741

-

$3.670

$3.280

$3.090

Verical

USA . 3,038 parts In-Stock

1+ parts

-

100+ parts

$4.588

1k+ parts

$4.100

10k+ parts

$3.862

3,038

-

$4.588

$4.100

$3.862

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,104 parts In-Stock

1+ parts

$3.876

100+ parts

-

1k+ parts

-

10k+ parts

-

1,104

$3.876

-

-

-

Vyrian

USA . 7,387 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,387

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 334 parts In-Stock

1+ parts

$3.672

100+ parts

-

1k+ parts

-

10k+ parts

-

334

$3.672

-

-

-

Corohmni

South Africa . 340 parts In-Stock

1+ parts

$4.080

100+ parts

-

1k+ parts

-

10k+ parts

-

340

$4.080

-

-

-

AZTECH Wire

Italy . 355 parts In-Stock

1+ parts

$8.910

100+ parts

-

1k+ parts

-

10k+ parts

-

355

$8.910

-

-

-

Continental Prestige Electronics

USA . 6,741 parts In-Stock

1+ parts

-

100+ parts

$3.530

1k+ parts

-

10k+ parts

-

6,741

-

$3.530

-

-

Kulean Microsystems

USA . 6,254 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,254

-

-

-

-

SupplyDigital Components

Austria . 4,510 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,510

-

-

-

-

TANS Electronics

Latvia . 1,405 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,405

-

-

-

-

Problanco Electronics

Mexico . 1,276 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,276

-

-

-

-

Microchip USA

USA . 426 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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426

-

-

-

-

UHIMA Technologies

Türkiye . 310 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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310

-

-

-

-

Overview

Looking for a reliable and high-quality multiplexer/demultiplexer? Look no further than the MC10H158PG by Onsemi. With a reputable manufacturer like Onsemi, you can trust in the durability and performance of this product. Perfect for a variety of applications, this versatile device offers fast propagation delays, multiple functions, and a compact design. Experience the value and benefits that the MC10H158PG brings to your projects, providing seamless operation and efficiency. Choose Onsemi for top-notch quality and innovation in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body makes the product lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 2.9 ns

With a fast propagation delay, this product ensures efficient signal routing and processing.

No. of Functions: 4

Having multiple functions in one device enhances its versatility and allows for more complex operations.

No. of Inputs: 2

With two inputs, this multiplexer & demultiplexer can handle multiple input signals efficiently.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to integrate this product into existing circuit designs and setups.

No. of Terminals: 16

Having ample terminals allows for easy connectivity and compatibility with various systems and configurations.

Propagation Delay (tpd): 1.9 ns

The low propagation delay ensures minimal delay in signal transmission, improving overall system performance.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions.

Output Characteristics: OPEN-EMITTER

The open-emitter output characteristics provide flexibility in circuit design and compatibility with different output devices.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Terminal Finish: TIN

The terminal finish with tin coating ensures good electrical conductivity and corrosion resistance.

Terminal Position: DUAL

The dual terminal position allows for easy installation and connectivity in various orientations.

Maximum Seated Height: 4.44 mm

The compact seated height makes this product suitable for applications with space constraints.

Width: 7.62 mm

The slim width of the product enables efficient PCB layout and space-saving integration.

Output Polarity: TRUE

The true output polarity ensures accurate signal processing and interpretation.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this product is suitable for reflow soldering processes without compromising its integrity.

Length: 19.175 mm

The length of the product provides sufficient space for terminal placement and ensures compatibility with standard PCB sizes.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade indicates that this product meets industry standards and is suitable for a wide range of commercial applications.

Technology: ECL

The ECL technology used in this product ensures high-speed performance and low power consumption.

Terminal Form: THROUGH-HOLE

The through-hole terminal form facilitates easy soldering and secure mounting on PCBs.

Packing Method: RAIL

The rail packing method provides convenience in handling and storage of multiple units of this product.

Terminal Pitch: 2.54 mm

The standard terminal pitch allows for easy integration with common connectors and PCB layouts.

Maximum Power Supply Current (ICC): 53 mA

With a maximum power supply current of 53 mA, this product ensures efficient power management and safe operation within specified limits.

Technical Specifications

Multiplexer & Demultiplexer MC10H158PG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

53 mA

Propagation Delay At Nominal Supply:

2.9 ns

Propagation Delay (tpd):

1.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Multiplexer/Demultiplexers

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC10H158PG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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