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MC10H113ML1

Onsemi

MC10H113ML1 by Onsemi

MC10H113ML1 by Onsemi is a Logic Gates IC with 4 functions, 2 inputs, and 1.9 ns propagation delay at -5.2V supply voltage. It operates in the temperature range of 0-70 °C and uses ECL technology. This IC is commonly used in commercial applications requiring fast signal processing.

Median Price

$1.014

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.978

1k+ parts

$0.811

10k+ parts

$0.723

1,000

-

$0.978

$0.811

$0.723

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.220

10k+ parts

-

1,000

-

-

$1.220

-

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.014

10k+ parts

$0.904

1,000

-

-

$1.014

$0.904

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,029 parts In-Stock

1+ parts

$0.762

100+ parts

-

1k+ parts

-

10k+ parts

-

2,029

$0.762

-

-

-

Vyrian

USA . 3,051 parts In-Stock

1+ parts

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3,051

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 55 parts In-Stock

1+ parts

$0.657

100+ parts

-

1k+ parts

-

10k+ parts

-

55

$0.657

-

-

-

Corphita

USA . 2,459 parts In-Stock

1+ parts

$0.722

100+ parts

-

1k+ parts

-

10k+ parts

-

2,459

$0.722

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 10,637 parts In-Stock

1+ parts

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100+ parts

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10,637

-

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SupplyDigital Components

Austria . 5,431 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,431

-

-

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TANS Electronics

Latvia . 4,008 parts In-Stock

1+ parts

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4,008

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Problanco Electronics

Mexico . 1,032 parts In-Stock

1+ parts

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1,032

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Continental Prestige Electronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.696

1k+ parts

-

10k+ parts

-

1,000

-

$0.696

-

-

Kulean Microsystems

USA . 553 parts In-Stock

1+ parts

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100+ parts

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553

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UHIMA Technologies

Türkiye . 505 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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505

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-

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Overview

Experience seamless logic gate functionality with the MC10H113ML1 by Onsemi. Crafted with top-quality materials, this product offers unparalleled reliability and performance in a wide range of applications. With a low propagation delay and multiple functions, this logic gate is designed to streamline your projects and maximize efficiency. Trust in Onsemi's expertise and innovation to deliver a product that exceeds expectations, providing you with the value and benefits you need to succeed. Elevate your designs with the MC10H113ML1 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY as the package body material provides durability and protection for the internal components of the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 1.9 ns

The low propagation delay of 1.9 ns at nominal supply voltage ensures fast and efficient signal processing, making this product suitable for high-speed applications.

No. of Functions: 4

With 4 functions available in a single package, this product offers versatility and flexibility in designing complex logic circuits efficiently.

No. of Inputs: 2

Having 2 inputs allows for basic logic operations to be performed, making this product suitable for simple logic designs and applications.

Nominal Supply Voltage / Vsup (V): -5.2

The -5.2V nominal supply voltage provides stable power to the logic gates, ensuring consistent and reliable performance in operation.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product can withstand high temperatures without compromising its functionality, making it suitable for various environmental conditions.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C ensures that the logic gates can function effectively even in cold environments, increasing their reliability and versatility.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of Nickel/Palladium/Gold provides excellent conductivity and corrosion resistance, enhancing the durability and performance of the logic gates.

Minimum Supply Voltage (Vsup): -4.94 V

The -4.94V minimum supply voltage ensures that the logic gates can operate efficiently even with low power input, making them suitable for energy-efficient applications.

Technology: ECL

The use of ECL technology in these logic gates offers high-speed operation and low power consumption, making them ideal for applications requiring quick response times and efficient power usage.

Packing Method: TR

The TR packing method ensures convenient handling and storage of the logic gates, making them easy to integrate into circuit designs and production processes.

Maximum Supply Voltage (Vsup): -5.46 V

The -5.46V maximum supply voltage provides a safe operational range for the logic gates, protecting them from overvoltage conditions and ensuring their longevity and reliability.

Technical Specifications

Logic Gates MC10H113ML1 attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

JESD-609 Code:

e4

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Packing Method:

TR

Propagation Delay At Nominal Supply:

1.9 ns

Propagation Delay (tpd):

2.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

-5.46 V

Minimum Supply Voltage (Vsup):

-4.94 V

Nominal Supply Voltage / Vsup (V):

-5.2

Technology:

ECL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Trade Compliance

MC10H113ML1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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