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MC10H103MELG

Onsemi

MC10H103MELG by Onsemi

MC10H103MELG by Onsemi is a Logic Gates IC with 4 functions and 2 inputs. It has a propagation delay of 1.3 ns at -5.2V, making it suitable for high-speed applications in commercial extended temperature environments. The small outline package with gull wing terminals and surface mount capability enhances ease of installation and reliability.

Median Price

$2.320

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 48,722 parts In-Stock

1+ parts

-

100+ parts

$2.190

1k+ parts

$1.960

10k+ parts

$1.850

48,722

-

$2.190

$1.960

$1.850

Verical

USA . 1,028 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.450

10k+ parts

-

1,028

-

-

$2.450

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 943 parts In-Stock

1+ parts

$2.328

100+ parts

-

1k+ parts

-

10k+ parts

-

943

$2.328

-

-

-

Vyrian

USA . 5,859 parts In-Stock

1+ parts

-

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-

5,859

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,874 parts In-Stock

1+ parts

$2.205

100+ parts

-

1k+ parts

-

10k+ parts

-

1,874

$2.205

-

-

-

Corohmni

South Africa . 306 parts In-Stock

1+ parts

$2.450

100+ parts

-

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-

306

$2.450

-

-

-

AZTECH Wire

Italy . 661 parts In-Stock

1+ parts

$17.610

100+ parts

-

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661

$17.610

-

-

-

Continental Prestige Electronics

USA . 48,722 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.120

10k+ parts

-

48,722

-

-

$2.120

-

TANS Electronics

Latvia . 3,752 parts In-Stock

1+ parts

-

100+ parts

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3,752

-

-

-

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Problanco Electronics

Mexico . 3,179 parts In-Stock

1+ parts

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3,179

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-

-

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SupplyDigital Components

Austria . 2,721 parts In-Stock

1+ parts

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2,721

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Kulean Microsystems

USA . 2,177 parts In-Stock

1+ parts

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2,177

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UHIMA Technologies

Türkiye . 890 parts In-Stock

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890

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Microchip USA

USA . 349 parts In-Stock

1+ parts

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349

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Kepictronics

USA . 90 parts In-Stock

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1k+ parts

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90

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Overview

Experience the cutting-edge technology of Onsemi with the MC10H103MELG logic gates. Offering high-quality performance and reliability, these logic gates are designed to exceed your expectations. With a multitude of applications in various industries, this product provides unparalleled value and benefits to customers seeking efficient and effective solutions. Trust in Onsemi's expertise and innovation to take your projects to the next level.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 1.45 ns

Low propagation delay ensures fast processing of inputs, making this product suitable for high-speed applications.

No. of Functions: 4

Having multiple functions in a single package provides increased functionality and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): -5.2

Stable supply voltage ensures reliable operation of the logic gates within the specified voltage range.

Maximum Operating Temperature: 75 °C

Ability to operate at high temperatures without performance degradation makes this product suitable for various environments.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, making it a preferred choice for demanding applications.

Technical Specifications

Logic Gates MC10H103MELG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay At Nominal Supply:

1.45 ns

Propagation Delay (tpd):

1.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

-5.46 V

Minimum Supply Voltage (Vsup):

-4.94 V

Nominal Supply Voltage / Vsup (V):

-5.2

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H103MELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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