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MC10H103FNG

Onsemi

MC10H103FNG by Onsemi

MC10H103FNG by Onsemi is a Logic Gates chip with 4 functions, 2 inputs, and propagation delay of 1.3 ns. It operates at -5.2V voltage, in commercial extended temperature range (0-75 °C). This ECL technology chip is used for high-speed signal processing applications.

Median Price

$2.320

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,108 parts In-Stock

1+ parts

-

100+ parts

$2.190

1k+ parts

$1.960

10k+ parts

$1.850

7,108

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$2.190

$1.960

$1.850

Verical

USA . 3,486 parts In-Stock

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$2.450

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3,486

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$2.450

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Distributors (In-Stock)

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Digiode

USA . 2,116 parts In-Stock

1+ parts

$2.328

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2,116

$2.328

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DigiKey Marketplace

USA . 7,108 parts In-Stock

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7,108

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Vyrian

USA . 4,932 parts In-Stock

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4,932

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Prism Electronics

USA . 111 parts In-Stock

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111

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Distributors (Availability)

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Corphita

USA . 1,165 parts In-Stock

1+ parts

$2.205

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1,165

$2.205

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Corohmni

South Africa . 216 parts In-Stock

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$2.450

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216

$2.450

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Component Stockers USA

USA . 5,968 parts In-Stock

1+ parts

$2.500

100+ parts

$2.350

1k+ parts

$2.130

10k+ parts

-

5,968

$2.500

$2.350

$2.130

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AZTECH Wire

Italy . 490 parts In-Stock

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$16.550

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490

$16.550

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$31.171

100+ parts

$28.366

1k+ parts

$25.560

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-

1,000

$31.171

$28.366

$25.560

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Continental Prestige Electronics

USA . 7,108 parts In-Stock

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$2.120

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$2.120

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Problanco Electronics

Mexico . 6,742 parts In-Stock

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Kulean Microsystems

USA . 6,064 parts In-Stock

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SupplyDigital Components

Austria . 5,068 parts In-Stock

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TANS Electronics

Latvia . 2,185 parts In-Stock

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UHIMA Technologies

Türkiye . 790 parts In-Stock

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Microchip USA

USA . 300 parts In-Stock

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Perfect Parts

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Kepictronics

USA . 96 parts In-Stock

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Overview

Elevate your projects with the MC10H103FNG Logic Gates from Onsemi, a leader in innovative semiconductor solutions. Designed for high-speed performance, this chip carrier package boasts 4 functions and 2 inputs, offering unparalleled reliability and efficiency. Whether you're working on telecommunications, industrial automation, or consumer electronics, trust Onsemi's top-quality components to deliver exceptional results. Upgrade your designs today with the MC10H103FNG and experience the difference that Onsemi's cutting-edge technology can make for your products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost-effectiveness, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 1.45 ns

With a low propagation delay, this product ensures fast operation and high-speed performance in logic operations.

Surface Mount: YES

Being surface mountable makes this product easy to integrate into circuit boards, saving space and simplifying installation.

No. of Functions: 4

Having multiple functions in one package increases the versatility and functionality of the product, making it a cost-effective solution.

No. of Inputs: 2

With a moderate number of inputs, this product is suitable for basic logic operations and simpler circuit designs.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board and easy integration with other components.

Nominal Supply Voltage / Vsup (V): -5.2

The specified nominal supply voltage ensures compatibility with standard power sources, making the product widely applicable.

No. of Terminals: 20

Having a sufficient number of terminals allows for versatile connectivity options and compatibility with various circuit configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier style of packaging provides durability and protection for the internal components, ensuring long-term reliability.

Propagation Delay (tpd): 1.3 ns

A low propagation delay indicates fast signal propagation within the device, leading to high-speed performance and efficient logic operations.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and maintain performance under stress.

Minimum Operating Temperature: 0 °C

The specified minimum operating temperature ensures reliable performance in a wide range of temperature environments, making the product versatile.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance, ensuring reliable electrical connections and long-term performance.

Terminal Position: QUAD

The quad terminal position allows for easy connection to external components and efficient routing of signals, enhancing the overall usability of the product.

Maximum Seated Height: 4.57 mm

With a relatively low seated height, this product can be easily accommodated in compact electronic devices and space-constrained applications.

Width: 8.965 mm

The specified width provides a compact form factor, enabling easy integration into circuit designs and ensuring efficient use of space.

Minimum Supply Voltage (Vsup): -4.94 V

The minimum supply voltage ensures reliable operation within a specified voltage range, providing flexibility in power supply options.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this product can undergo reflow processes efficiently, facilitating easy assembly and soldering.

Peak Reflow Temperature °C: 260

The specified peak reflow temperature ensures proper soldering and assembly of the product, contributing to reliable performance under thermal stress.

Length: 8.965 mm

The specified length provides a compact form factor, enabling easy integration into circuit designs and ensuring efficient use of space.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade ensures reliable performance in a wide range of temperature environments, making the product versatile for commercial applications.

Technology: ECL

ECL (Emitter-Coupled Logic) technology offers high-speed operation and low power consumption, making the product suitable for high-performance logic applications.

Terminal Form: J BEND

The J bend terminal form allows for easy soldering and secure connections, ensuring reliable electrical contact and long-term performance.

Packing Method: RAIL

The rail packing method provides efficient storage and handling of the product, making it convenient for production and assembly processes.

Terminal Pitch: 1.27 mm

A standard terminal pitch allows for compatibility with common connectors and soldering techniques, facilitating easy integration into circuit designs.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product can withstand moderate moisture exposure during storage and handling, ensuring reliability in various environmental conditions.

Maximum Supply Voltage (Vsup): -5.46 V

The specified maximum supply voltage ensures safe operation within the specified voltage range, providing protection against overvoltage conditions.

Technical Specifications

Logic Gates MC10H103FNG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

COMPLEMENTARY O/P FOR 1 FUNCTION

Family:

10H

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Propagation Delay At Nominal Supply:

1.45 ns

Propagation Delay (tpd):

1.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.57 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

-5.46 V

Minimum Supply Voltage (Vsup):

-4.94 V

Nominal Supply Voltage / Vsup (V):

-5.2

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.965 mm

Trade Compliance

MC10H103FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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