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MC10H102MEL

Onsemi

MC10H102MEL by Onsemi

MC10H102MEL by Onsemi is a Logic Gate with 4 functions and 2 inputs. It has a propagation delay of 1.25 ns at -5.2V, suitable for high-speed applications in commercial extended temperature range. Package style is small outline, surface mountable with dual terminal position.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

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AZTECH Wire

Italy . 1,041 parts In-Stock

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Component Stockers USA

USA . 206 parts In-Stock

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Perfect Parts

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Problanco Electronics

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Kepictronics

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Kulean Microsystems

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TANS Electronics

Latvia . 3,252 parts In-Stock

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SupplyDigital Components

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Authorized Procurement Solutions

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UHIMA Technologies

Türkiye . 983 parts In-Stock

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Microchip USA

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Overview

Elevate your logic gate performance with the MC10H102MEL by Onsemi. Crafted from high-quality materials and backed by a reputable manufacturer, this product offers unparalleled speed and efficiency in a compact package. Ideal for a wide range of applications, this logic gate provides reliable functionality with minimal delay, making it a valuable asset for any project. Upgrade your circuit design with the MC10H102MEL and experience the benefits of precision engineering at its finest.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 1.4 ns

Low propagation delay ensures quick response time, making this logic gate suitable for high-speed applications.

No. of Functions: 4

With 4 functions in one gate, it provides versatility in circuit design and saves space on the circuit board.

No. of Inputs: 2

Having 2 inputs allows for simple logic operations, making it easy to incorporate into various digital circuits.

Nominal Supply Voltage: -5.2 V

Stable supply voltage ensures consistent performance of the logic gate in different operating conditions.

Maximum Operating Temperature: 75 °C

Wide operating temperature range makes this logic gate suitable for use in various environments without overheating.

Technical Specifications

Logic Gates MC10H102MEL attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay At Nominal Supply:

1.4 ns

Propagation Delay (tpd):

1.25 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.05 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

-5.46 V

Minimum Supply Voltage (Vsup):

-4.94 V

Nominal Supply Voltage / Vsup (V):

-5.2

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H102MEL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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