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MC10EP56DTG

Onsemi

MC10EP56DTG by Onsemi

MC10EP56DTG by Onsemi is a 2-function multiplexer with 2 inputs, operating at -40 to 85 °C. It has a propagation delay of 0.47 ns and requires a nominal voltage of 3.3 V. Ideal for industrial applications requiring high-speed signal switching in compact spaces.

Median Price

$10.980

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 21 parts In-Stock

1+ parts

$12.574

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-

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21

$12.574

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Mouser Electronics

USA . 215 parts In-Stock

1+ parts

$13.230

100+ parts

$9.080

1k+ parts

$8.080

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-

215

$13.230

$9.080

$8.080

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DigiKey

USA . 57 parts In-Stock

1+ parts

$13.230

100+ parts

$9.081

1k+ parts

$8.340

10k+ parts

$8.160

57

$13.230

$9.081

$8.340

$8.160

Rochester

USA . 2,772 parts In-Stock

1+ parts

-

100+ parts

$7.510

1k+ parts

$6.720

10k+ parts

$6.320

2,772

-

$7.510

$6.720

$6.320

Verical

USA . 1,446 parts In-Stock

1+ parts

-

100+ parts

$9.387

1k+ parts

$8.400

10k+ parts

$7.900

1,446

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$9.387

$8.400

$7.900

Flip Electronics (Authorized)

USA . 75 parts In-Stock

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Arrow

USA . 21 parts In-Stock

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$7.774

1k+ parts

$7.625

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21

-

$7.774

$7.625

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,482 parts In-Stock

1+ parts

$7.923

100+ parts

-

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1,482

$7.923

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Bristol Electronics

USA . 452 parts In-Stock

1+ parts

$9.203

100+ parts

$6.442

1k+ parts

$5.982

10k+ parts

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452

$9.203

$6.442

$5.982

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Vyrian

USA . 8,471 parts In-Stock

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8,471

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ACDS - Activité Composants Distribution Service

France . 452 parts In-Stock

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452

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Dan-Mar Components

USA . 452 parts In-Stock

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452

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Flip Electronics

USA . 75 parts In-Stock

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75

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Semtec, LLC

USA . 33 parts In-Stock

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33

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Elcom Components

USA . 10 parts In-Stock

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10

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Prism Electronics

USA . 6 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 431 parts In-Stock

1+ parts

$7.483

100+ parts

-

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431

$7.483

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Corphita

USA . 2,481 parts In-Stock

1+ parts

$7.506

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2,481

$7.506

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Component Stockers USA

USA . 3,174 parts In-Stock

1+ parts

$8.460

100+ parts

$7.960

1k+ parts

$7.190

10k+ parts

-

3,174

$8.460

$7.960

$7.190

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Microchip USA

USA . 2,928 parts In-Stock

1+ parts

$37.410

100+ parts

$36.870

1k+ parts

$36.610

10k+ parts

$36.340

2,928

$37.410

$36.870

$36.610

$36.340

Advanced Electronics

New Zealand . 76 parts In-Stock

1+ parts

$39.996

100+ parts

$36.396

1k+ parts

$32.797

10k+ parts

-

76

$39.996

$36.396

$32.797

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SupplyDigital Components

Austria . 5,870 parts In-Stock

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5,870

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Problanco Electronics

Mexico . 4,898 parts In-Stock

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Kulean Microsystems

USA . 3,866 parts In-Stock

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TANS Electronics

Latvia . 3,097 parts In-Stock

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Continental Prestige Electronics

USA . 2,052 parts In-Stock

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UHIMA Technologies

Türkiye . 754 parts In-Stock

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754

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Perfect Parts

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Kepictronics

USA . 89 parts In-Stock

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Authorized Procurement Solutions

USA . 33 parts In-Stock

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Overview

Enhance your electronic designs with the MC10EP56DTG from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality multiplexers & demultiplexers that offer superior performance and reliability. Ideal for a wide range of applications, this product provides customers with unmatched value and benefits. Experience seamless operation and enhanced functionality with the MC10EP56DTG, making it the perfect choice for all your electronics needs. Elevate your projects today with Onsemi's innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the multiplexer & demultiplexer, ensuring a longer lifespan.

Surface Mount: YES

Allows for convenient and easy installation on PCBs, making it suitable for automated assembly processes.

No. of Functions: 2

Provides flexibility in multiplexing and demultiplexing signals or data, making the product versatile for various applications.

No. of Inputs: 2

Allows for efficient and simple signal routing and switching between two input channels.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a standard voltage level, ensuring compatibility with most systems and power sources.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature environments, expanding its usability in different operating conditions.

Maximum Operating Temperature: 85 °C

Designed to withstand high temperatures, making it suitable for industrial applications where heat may be a concern.

Maximum Power Supply Current (ICC): 78 mA

Efficient power consumption ensures lower energy costs and reduces heat generation during operation.

Technical Specifications

Multiplexer & Demultiplexer MC10EP56DTG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE OPERATING RANGE: VCC = 0 V WITH VEE = -3.0 V TO -5.5 V

Family:

10E

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

SERIES-RESISTOR

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

78 mA

Propagation Delay (tpd):

.47 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

MC10EP56DTG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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