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MC10EL01DR2G

Onsemi

MC10EL01DR2G by Onsemi

MC10EL01DR2G by Onsemi is a logic gate with 4 inputs, 0.33 ns propagation delay, and -40 to 85°C operating temperature range. Ideal for industrial applications requiring fast signal processing in compact designs. Package style: small outline, surface mountable with dual terminals.

Median Price

$3.138

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,251 parts In-Stock

1+ parts

$11.200

100+ parts

$5.900

1k+ parts

$4.390

10k+ parts

-

2,251

$11.200

$5.900

$4.390

-

Rochester

USA . 17,727 parts In-Stock

1+ parts

-

100+ parts

$2.800

1k+ parts

$2.510

10k+ parts

$2.360

17,727

-

$2.800

$2.510

$2.360

Verical

USA . 8,112 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.138

10k+ parts

$2.950

8,112

-

-

$3.138

$2.950

Distributors (In-Stock)

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Digiode

USA . 1,134 parts In-Stock

1+ parts

$2.964

100+ parts

-

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1,134

$2.964

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Vyrian

USA . 6,695 parts In-Stock

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6,695

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Distributors (Availability)

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Corphita

USA . 335 parts In-Stock

1+ parts

$2.808

100+ parts

-

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335

$2.808

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-

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Corohmni

South Africa . 71 parts In-Stock

1+ parts

$3.120

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-

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71

$3.120

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AZTECH Wire

Italy . 573 parts In-Stock

1+ parts

$22.140

100+ parts

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573

$22.140

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Continental Prestige Electronics

USA . 18,297 parts In-Stock

1+ parts

-

100+ parts

$3.750

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18,297

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$3.750

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Perfect Parts

USA . 15,431 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,008 parts In-Stock

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8,008

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TANS Electronics

Latvia . 3,587 parts In-Stock

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3,587

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Kulean Microsystems

USA . 3,453 parts In-Stock

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3,453

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Authorized Procurement Solutions

USA . 2,257 parts In-Stock

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2,257

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GreenTree Electronics

Israel . 2,257 parts In-Stock

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Problanco Electronics

Mexico . 1,540 parts In-Stock

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SupplyDigital Components

Austria . 981 parts In-Stock

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981

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Microchip USA

USA . 400 parts In-Stock

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400

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UHIMA Technologies

Türkiye . 214 parts In-Stock

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214

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Overview

Experience unparalleled speed and precision with the MC10EL01DR2G by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their logic gates. Ideal for applications requiring high-speed data transmission, this product offers a swift propagation delay of 0.37 ns, making it a valuable asset for your projects. With a nominal supply voltage of 5V and open-emitter output characteristics, the MC10EL01DR2G provides efficient performance even in industrial temperatures. Upgrade your circuits with this compact and versatile component, designed to meet all your speed and accuracy needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the logic gates, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 0.37 ns

Low propagation delay allows for fast processing of signals, making these logic gates suitable for high-speed applications.

Surface Mount: YES

Surface mount capability makes installation and integration of these logic gates easier and more convenient.

No. of Inputs: 4

Having 4 inputs provides flexibility in designing logic circuits and allows for more complex operations to be performed.

Nominal Supply Voltage / Vsup (V): 5

Compatible with a commonly used supply voltage of 5V, making these logic gates versatile and easy to integrate into existing systems.

Power Supplies (V): -5.2

Supports negative power supplies, which can be useful in certain applications where dual power supplies are needed.

No. of Terminals: 8

Having 8 terminals provides convenient connectivity options for interfacing with other components in the circuit.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without performance degradation, suitable for industrial and harsh environment applications.

Output Characteristics: OPEN-EMITTER

Open-emitter output configuration allows for flexibility in connecting to different types of loads and devices.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, making these logic gates efficient and reliable.

Technical Specifications

Logic Gates MC10EL01DR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

10EL

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

4

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

17 mA

Propagation Delay At Nominal Supply:

.37 ns

Propagation Delay (tpd):

.33 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC10EL01DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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