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MC10E1651FNG

Onsemi

MC10E1651FNG by Onsemi

MC10E1651FNG by Onsemi is a digital arithmetic circuit with 2 functions, operating at 5V. It has a propagation delay of 1.075ns and operates in temperatures ranging from 0 to 85 °C. This chip carrier package is ideal for applications requiring fast signal processing in electronic systems.

Median Price

$31.635

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 32,823 parts In-Stock

1+ parts

-

100+ parts

$28.120

1k+ parts

$25.160

10k+ parts

$23.680

32,823

-

$28.120

$25.160

$23.680

DigiKey

USA . 32,823 parts In-Stock

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-

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32,823

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Verical

USA . 11,922 parts In-Stock

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-

100+ parts

$35.150

1k+ parts

$31.450

10k+ parts

$29.600

11,922

-

$35.150

$31.450

$29.600

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 791 parts In-Stock

1+ parts

$29.697

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791

$29.697

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Vyrian

USA . 8,277 parts In-Stock

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8,277

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Chip Stock

USA . 6,109 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 114 parts In-Stock

1+ parts

$13.190

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114

$13.190

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Corphita

USA . 148 parts In-Stock

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$28.134

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-

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148

$28.134

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Corohmni

South Africa . 239 parts In-Stock

1+ parts

$31.260

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239

$31.260

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Continental Prestige Electronics

USA . 32,828 parts In-Stock

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32,828

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SupplyDigital Components

Austria . 7,636 parts In-Stock

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Microchip USA

USA . 7,170 parts In-Stock

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Kulean Microsystems

USA . 3,006 parts In-Stock

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3,006

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TANS Electronics

Latvia . 1,395 parts In-Stock

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1,395

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Problanco Electronics

Mexico . 592 parts In-Stock

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UHIMA Technologies

Türkiye . 7 parts In-Stock

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Unlock the power of digital arithmetic circuits with the MC10E1651FNG by Onsemi. Manufactured with precision and expertise, this cutting-edge product offers unparalleled quality and reliability. Ideal for a wide range of applications, this chip carrier package ensures seamless integration and exceptional performance. Elevate your projects with the advantages of a nominal supply voltage of 5V, fast propagation delay of 1.075ns, and complementary output polarity. Experience the value and benefits of the MC10E1651FNG and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the circuit, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

No. of Functions: 2

Provides versatile functionality in a single component, saving space and cost in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard power supply voltages, making it widely applicable in different electronic systems.

Propagation Delay (tpd): 1.075 ns

Offers fast signal processing, crucial for high-speed digital arithmetic operations.

Minimum Operating Temperature: 0 °C

Works reliably in a wide range of temperature environments, ensuring consistent performance.

Output Polarity: COMPLEMENTARY

Supports both positive and negative logic operations, enhancing flexibility in circuit design.

Technology: ECL

Utilizes Emitter-Coupled Logic technology known for high-speed operation and low power consumption, ideal for digital arithmetic circuits.

Technical Specifications

Digital Arithmetic Circuits MC10E1651FNG attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Family:

10E

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

1.075 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.965 mm

Trade Compliance

MC10E1651FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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