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MC10E104FNG

Onsemi

MC10E104FNG by Onsemi

MC10E104FNG by Onsemi is a Logic Gates chip with 5 functions, 2 inputs, and 1ns propagation delay at 5V. It operates in the temperature range of 0-85°C and has a terminal pitch of 1.27mm. This ECL technology chip is used for high-speed applications requiring fast signal processing.

Median Price

$10.700

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3 parts In-Stock

1+ parts

$10.700

100+ parts

$7.630

1k+ parts

$6.510

10k+ parts

$5.610

3

$10.700

$7.630

$6.510

$5.610

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,763 parts In-Stock

1+ parts

$10.165

100+ parts

-

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1,763

$10.165

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Vyrian

USA . 2,835 parts In-Stock

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2,835

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Benley Electronics

USA . 69 parts In-Stock

1+ parts

$0.300

100+ parts

-

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69

$0.300

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Ampacity Inc.

Singapore . 393 parts In-Stock

1+ parts

$6.650

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393

$6.650

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Corohmni

South Africa . 51 parts In-Stock

1+ parts

$7.826

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51

$7.826

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Corphita

USA . 731 parts In-Stock

1+ parts

$9.630

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731

$9.630

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Perfect Parts

USA . 13,256 parts In-Stock

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Problanco Electronics

Mexico . 3,401 parts In-Stock

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3,401

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TANS Electronics

Latvia . 2,358 parts In-Stock

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2,358

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Microchip USA

USA . 2,251 parts In-Stock

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2,251

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Kepictronics

USA . 1,730 parts In-Stock

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1,730

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GreenTree Electronics

Israel . 1,730 parts In-Stock

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1,730

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Kulean Microsystems

USA . 1,350 parts In-Stock

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1,350

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SupplyDigital Components

Austria . 1,069 parts In-Stock

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1,069

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Continental Prestige Electronics

USA . 783 parts In-Stock

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783

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UHIMA Technologies

Türkiye . 398 parts In-Stock

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398

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Overview

Discover the innovative MC10E104FNG logic gates by Onsemi, a leading manufacturer known for its high-quality products. These logic gates offer fast propagation delays, making them ideal for applications where speed is crucial. With five functions and two inputs, this chip carrier package provides reliable performance in a compact design. Whether you're working on telecommunications, data communications, or industrial applications, the MC10E104FNG delivers superior results. Trust Onsemi to provide cutting-edge technology that meets your needs, offering unmatched value and benefits to customers. Elevate your projects with the MC10E104FNG logic gates today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers durability and protection for the components inside, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 1 ns

With a fast propagation delay of 1 ns at nominal supply voltage, this logic gate ensures quick response times in processing signals.

Surface Mount: YES

Being surface mountable, this logic gate can be easily integrated into circuit boards, saving space and simplifying the manufacturing process.

No. of Functions: 5

Having 5 functions in one component allows for more complex logic operations to be performed efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with a wide range of electronic systems and components.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this logic gate can function reliably in various environmental conditions.

Technology: ECL

Utilizing Emitter-Coupled Logic technology ensures high-speed operation and low power consumption, making it suitable for demanding applications.

Technical Specifications

Logic Gates MC10E104FNG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

10E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

5

No. of Inputs:

2

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

46 mA

Propagation Delay At Nominal Supply:

1 ns

Propagation Delay (tpd):

.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.57 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10E104FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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