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MC100EP57DT

Onsemi

MC100EP57DT by Onsemi

MC100EP57DT by Onsemi is a 4-input multiplexer with 0.52 ns propagation delay at 3.3V. It operates in industrial temperature range (-40 to 85 °C) and has a small outline package style. Ideal for high-speed applications requiring fast signal switching with complementary output polarity.

Median Price

$17.627

Lifecycle Status

Suppliers In-Stock

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Freelance Electronics

USA . 7 parts In-Stock

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Vyrian

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Digiode

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NAC Semi

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Sunrise Surplus Inc.

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Semi Source

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Sensible Micro Corp

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Sea View Technologies

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Bristol Electronics

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EMSNET

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AZTECH Wire

Italy . 340 parts In-Stock

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Corohmni

South Africa . 88 parts In-Stock

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Ampacity Inc.

Singapore . 659 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Kulean Microsystems

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SupplyDigital Components

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Microchip USA

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Speed Components Ltd (Excess)

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Overview

Unlock unparalleled performance and precision with the MC100EP57DT by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability, making this multiplexer/demultiplexer a standout choice for a wide range of applications. From telecommunications to data processing, this versatile component offers lightning-fast propagation delay, low power consumption, and seamless integration. Elevate your projects with the exceptional value and benefits that the MC100EP57DT brings to the table, setting you apart from the competition with its cutting-edge technology and superior design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Propagation Delay at Nominal Supply: 0.52 ns

With a fast propagation delay, this product ensures quick and efficient data transmission.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation, saving time and effort.

No. of Inputs: 4

Having 4 inputs provides versatility and flexibility in connecting multiple sources to the product.

Nominal Supply Voltage (Vsup): 3.3V

Operating at a low nominal supply voltage makes this product energy-efficient and cost-effective.

Power Supplies (V): -4.5

This product can handle a wide range of power supplies, making it adaptable to different power sources.

No. of Terminals: 20

With 20 terminals, this product offers ample connection options for complex systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and thin package style saves space and allows for high-density mounting.

Propagation Delay (tpd): 0.475 ns

A low propagation delay ensures minimal signal distortion and accurate data transmission.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this product suitable for various climates and environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish ensures reliable connections and corrosion resistance.

Terminal Position: DUAL

Dual terminal positions provide redundancy and enhance the product's reliability.

Maximum Seated Height: 1.2 mm

The low seated height allows for compact design and efficient use of space.

Width: 4.4 mm

The narrow width of this product makes it suitable for applications with limited space availability.

Output Polarity: COMPLEMENTARY

Having complementary output polarity ensures compatibility with various systems and devices.

Minimum Supply Voltage (Vsup): 3V

With a low minimum supply voltage requirement, this product is suitable for low power applications.

Maximum Time at Peak Reflow Temperature (s): 40

The product can withstand high temperatures for a specific time, ensuring durability during soldering processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering and assembly of the product.

Length: 6.5 mm

The compact length of this product makes it suitable for installations in confined spaces.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this product can withstand harsh operating conditions and temperature extremes.

Technology: ECL

Utilizing ECL technology ensures high-speed operation and low power consumption.

Terminal Form: GULL WING

The gull wing terminal form enhances solder joint reliability and mechanical strength.

Packing Method: RAIL

The rail packing method facilitates easy handling, transportation, and storage of the product.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting and efficient use of PCB space.

Maximum Supply Voltage (Vsup): 5.5V

With a high maximum supply voltage tolerance, this product is suitable for a wide range of applications.

Maximum Power Supply Current (ICC): 65 mA

The product's ability to handle a high power supply current ensures stable operation and reliable performance.

Technical Specifications

Multiplexer & Demultiplexer MC100EP57DT attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3.0V TO -5.5V;

Family:

100E

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

65 mA

Propagation Delay At Nominal Supply:

.52 ns

Propagation Delay (tpd):

.475 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

MC100EP57DT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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