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MC100EL57DG

Onsemi

MC100EL57DG by Onsemi

MC100EL57DG by Onsemi is a 4-input multiplexer with 0.56 ns propagation delay at 5V. It operates in industrial temperature range (-40 to 85 °C) and has a max supply voltage of 5.7V. Ideal for high-speed data communication systems due to its ECL technology and small outline package style.

Median Price

$7.091

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 11 parts In-Stock

1+ parts

$5.739

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-

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11

$5.739

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Chip1Stop

Japan . 16 parts In-Stock

1+ parts

$6.520

100+ parts

$6.330

1k+ parts

$6.300

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16

$6.520

$6.330

$6.300

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Mouser Electronics

USA . 53 parts In-Stock

1+ parts

$10.260

100+ parts

$7.220

1k+ parts

$6.440

10k+ parts

$6.360

53

$10.260

$7.220

$6.440

$6.360

DigiKey

USA . 15 parts In-Stock

1+ parts

$11.010

100+ parts

$7.680

1k+ parts

$6.848

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$6.704

15

$11.010

$7.680

$6.848

$6.704

Rochester

USA . 5,110 parts In-Stock

1+ parts

-

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$6.130

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$5.480

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$5.160

5,110

-

$6.130

$5.480

$5.160

Verical

USA . 2,579 parts In-Stock

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-

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$7.662

1k+ parts

$6.850

10k+ parts

$6.450

2,579

-

$7.662

$6.850

$6.450

Distributors (In-Stock)

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Digiode

USA . 1,433 parts In-Stock

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$6.242

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1,433

$6.242

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Vyrian

USA . 5,048 parts In-Stock

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Flip Electronics

USA . 2,256 parts In-Stock

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2,256

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Elcom Components

USA . 352 parts In-Stock

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Sensible Micro Corp

USA . 129 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 48 parts In-Stock

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ComSIT Distribution GmbH

Germany . 32 parts In-Stock

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Connector Distribution Corp

USA . 30 parts In-Stock

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Right Parts Inc.

USA . 30 parts In-Stock

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30

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Ashlea Components Ltd

UK . 23 parts In-Stock

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North Shore Components

USA . 13 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 400 parts In-Stock

1+ parts

$3.461

100+ parts

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400

$3.461

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Corphita

USA . 1,237 parts In-Stock

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$5.913

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1,237

$5.913

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Component Stockers USA

USA . 67 parts In-Stock

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$7.790

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67

$7.790

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$23.838

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$21.693

1k+ parts

$19.547

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$23.838

$21.693

$19.547

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Microchip USA

USA . 1,337 parts In-Stock

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$34.636

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$34.636

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Problanco Electronics

Mexico . 7,855 parts In-Stock

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7,855

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kulean Microsystems

USA . 4,505 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,038 parts In-Stock

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TANS Electronics

Latvia . 2,311 parts In-Stock

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SupplyDigital Components

Austria . 2,110 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 21 parts In-Stock

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Overview

Experience superior performance and reliability with the MC100EL57DG multiplexer/demultiplexer by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and precision engineering in all their products. Ideal for a wide range of applications, this device offers lightning-fast propagation delay, high-speed operation, and reliable output characteristics. Enhance your projects with the value, efficiency, and excellence that only the MC100EL57DG can provide. Choose Onsemi for unmatched quality and performance in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability for long-term use.

Propagation Delay At Nominal Supply: 0.58 ns

Low propagation delay ensures fast data transmission, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount capability makes it easy to integrate into circuit boards, saving space and simplifying the manufacturing process.

No. of Inputs: 4

Having 4 inputs allows for versatile signal routing options, making it suitable for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard electronic systems.

Output Characteristics: OPEN-EMITTER

Open-emitter output allows for flexibility in connecting to different types of circuits, enhancing compatibility.

Technology: ECL

ECL technology offers high-speed performance and excellent noise immunity, making the product reliable in demanding environments.

Technical Specifications

Multiplexer & Demultiplexer MC100EL57DG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Additional Features:

NECL MODE OPERATING RANGE: VEE = -4.2 V TO -5.7 V WITH VCC = 0 V

Family:

100EL

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

27 mA

Propagation Delay At Nominal Supply:

.58 ns

Propagation Delay (tpd):

.56 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC100EL57DG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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