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MC100E404FNG

Onsemi

MC100E404FNG by Onsemi

MC100E404FNG by Onsemi is a Logic Gates chip with 4 functions and 2 inputs. It has a propagation delay of 0.73 ns at 5V supply voltage, suitable for high-speed applications. With a package style of CHIP CARRIER, it operates b/w 0-85 °C temperature range.

Median Price

$6.244

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,264 parts In-Stock

1+ parts

-

100+ parts

$5.550

1k+ parts

$4.960

10k+ parts

$4.670

6,264

-

$5.550

$4.960

$4.670

Verical

USA . 2,199 parts In-Stock

1+ parts

-

100+ parts

$6.938

1k+ parts

$6.200

10k+ parts

$5.838

2,199

-

$6.938

$6.200

$5.838

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 229 parts In-Stock

1+ parts

$5.871

100+ parts

-

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-

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229

$5.871

-

-

-

Vyrian

USA . 4,024 parts In-Stock

1+ parts

-

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-

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4,024

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-

-

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Sunrise Surplus Inc.

USA . 4 parts In-Stock

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-

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,179 parts In-Stock

1+ parts

$5.562

100+ parts

-

1k+ parts

-

10k+ parts

-

2,179

$5.562

-

-

-

Corohmni

South Africa . 69 parts In-Stock

1+ parts

$6.180

100+ parts

-

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-

10k+ parts

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69

$6.180

-

-

-

Component Stockers USA

USA . 4,037 parts In-Stock

1+ parts

$6.390

100+ parts

$6.020

1k+ parts

$5.430

10k+ parts

-

4,037

$6.390

$6.020

$5.430

-

AZTECH Wire

Italy . 784 parts In-Stock

1+ parts

$16.800

100+ parts

-

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-

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784

$16.800

-

-

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TANS Electronics

Latvia . 7,481 parts In-Stock

1+ parts

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7,481

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SupplyDigital Components

Austria . 7,277 parts In-Stock

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7,277

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Continental Prestige Electronics

USA . 6,264 parts In-Stock

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6,264

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Kulean Microsystems

USA . 4,793 parts In-Stock

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4,793

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-

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Problanco Electronics

Mexico . 4,680 parts In-Stock

1+ parts

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4,680

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Microchip USA

USA . 4,550 parts In-Stock

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4,550

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UHIMA Technologies

Türkiye . 280 parts In-Stock

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280

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Overview

Elevate your logic gate applications with the MC100E404FNG by Onsemi. This high-quality product offers unparalleled performance and reliability, thanks to Onsemi's reputation for excellence. With a fast propagation delay of just 0.73 ns and 4 functions in one chip carrier package, this logic gate is perfect for a wide range of electronics projects. Trust in Onsemi to deliver cutting-edge technology that brings value and benefits to your designs. Upgrade your circuits today with the MC100E404FNG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection for the internal components of the logic gates, ensuring long-lasting performance.

Propagation Delay at Nominal Supply: 0.73 ns

Fast propagation delay allows for quick signal processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount design makes it easier to integrate these logic gates onto circuit boards, saving space and streamlining the manufacturing process.

Nominal Supply Voltage: 5V

Operating at a nominal supply voltage of 5V makes these logic gates compatible with a wide range of existing circuits and systems.

Output Characteristics: OPEN-EMITTER

Open-emitter output characteristics provide flexibility for connecting to various components and allows for customization of output signals.

Technical Specifications

Logic Gates MC100E404FNG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

146 mA

Propagation Delay At Nominal Supply:

.73 ns

Propagation Delay (tpd):

.725 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.57 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100E404FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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