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MAC997A6RLRPG

Onsemi

MAC997A6RLRPG by Onsemi

MAC997A6RLRPG by Onsemi is a single TRIAC with 3 terminals. It has a max RMS on-state current of 0.8A and can handle a repetitive peak off-state voltage of 400V. Ideal for applications requiring precise AC power control in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,547 parts In-Stock

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Digiode

USA . 998 parts In-Stock

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998

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Problanco Electronics

Mexico . 8,178 parts In-Stock

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8,178

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SupplyDigital Components

Austria . 8,038 parts In-Stock

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Kulean Microsystems

USA . 5,314 parts In-Stock

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TANS Electronics

Latvia . 1,453 parts In-Stock

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Corphita

USA . 977 parts In-Stock

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Corohmni

South Africa . 371 parts In-Stock

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UHIMA Technologies

Türkiye . 143 parts In-Stock

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Overview

Enhance your electrical designs with the MAC997A6RLRPG by Onsemi, a top-quality TRIAC that offers unparalleled performance and reliability. Onsemi is a trusted manufacturer known for producing high-grade components, ensuring that this product meets the highest industry standards. Ideal for a wide range of applications, this TRIAC is designed to provide customers with exceptional value and benefits. Say goodbye to frequent replacements and hello to long-lasting, efficient performance with the MAC997A6RLRPG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting and reliable.

Maximum DC Gate Trigger Current: 5 mA

Allows for efficient triggering of the TRIAC, ensuring precise performance.

Configuration: SINGLE

Simplifies installation and operation of the product.

Package Shape: ROUND

Facilitates easy mounting and handling of the TRIAC.

Maximum Leakage Current: 0.01 mA

Ensures minimal power wastage and efficient operation.

No. of Terminals: 3

Provides necessary connections for the device to function effectively.

Package Style (Meter): CYLINDRICAL

Offers a compact and space-saving design for versatile applications.

Maximum Operating Temperature: 110 °C

Allows the product to function reliably in high-temperature environments.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

Enables precise control and efficient switching of the TRIAC.

Minimum Operating Temperature: -40 °C

Ensures the product can operate in cold conditions without any issues.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

Facilitates easy installation and maintenance of the product.

Maximum RMS On-state Current: 0.8 A

Handles high current loads efficiently for various applications.

Maximum DC Gate Trigger Voltage: 2 V

Ensures reliable triggering of the TRIAC with a low voltage.

Repetitive Peak Off-state Voltage: 400 V

Can handle high voltage loads safely and effectively.

Minimum Critical Rate of Rise of Off-state Voltage: 20 V/us

Ensures stability and protection against sudden voltage spikes.

Maximum Holding Current: 10 mA

Maintains the ON state of the TRIAC even after the gate current is removed.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes for assembly.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC997A6RLRPG attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

20 V/us

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

10 mA

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e1

Maximum Leakage Current:

.01 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

ROUND

Package Style (Meter):

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum RMS On-state Current:

.8 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC997A6RLRPG Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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