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MAC15SNG

Onsemi

MAC15SNG by Onsemi

MAC15SNG by Onsemi is a single TRIAC with 15A RMS on-state current and 800V repetitive peak off-state voltage. Ideal for AC applications, it has a max operating temperature of 110 °C and min of -40°C. With a trigger device type of 4QLL TRIAC, it features a DC gate trigger current of 5mA and leakage current of 2mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,051 parts In-Stock

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Vyrian

USA . 2,048 parts In-Stock

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AZTECH Wire

Italy . 894 parts In-Stock

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Kepictronics

USA . 15,000 parts In-Stock

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Kulean Microsystems

USA . 6,287 parts In-Stock

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SupplyDigital Components

Austria . 5,590 parts In-Stock

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Problanco Electronics

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A-Z Elektronik GmbH

Germany . 5,156 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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TANS Electronics

Latvia . 4,596 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,437 parts In-Stock

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UHIMA Technologies

Türkiye . 826 parts In-Stock

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Corohmni

South Africa . 475 parts In-Stock

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Corphita

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Overview

Discover the MAC15SNG by Onsemi, a high-quality TRIAC perfect for a wide range of applications. With a reputation for excellence, Onsemi delivers top-of-the-line products that are reliable and efficient. The MAC15SNG offers customers the value of superior performance and durability, with benefits such as easy installation and optimized functionality. Whether you're looking to control power in lighting, heating, or motor speed applications, this TRIAC is the perfect solution. Upgrade your systems with the MAC15SNG and experience the advantage of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection, making the TRIAC durable and reliable.

Maximum DC Gate Trigger Current: 5 mA

Low trigger current ensures efficient and precise control of the TRIAC.

Configuration: SINGLE

Simplified design and installation process with a single configuration.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and fitting in various applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and stability.

Maximum Operating Temperature: 110 °C

High operating temperature range allows for use in a wide range of environments and applications.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

This type of trigger device offers precise and reliable switching performance.

Repetitive Peak Off-state Voltage: 800 V

High off-state voltage rating ensures safe and efficient operation in various circuits.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC15SNG attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

25 V/us

Maximum DC Gate Trigger Current:

5 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

10 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum RMS On-state Current:

15 A

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC15SNG Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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