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BTB26-600B

STMicroelectronics

BTB26-600B by STMicroelectronics

STMicroelectronics' BTB26-600B is a TRIAC with 600V repetitive peak off-state voltage and 30A max RMS on-state current. It operates b/w -40°C to 110°C, with a max DC gate trigger voltage of 3V. Ideal for applications requiring precise AC power control in various electronic devices.

Median Price

$4.970

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 49 parts In-Stock

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$4.970

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Digiode

USA . 4,337 parts In-Stock

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VNN

France . 2,181 parts In-Stock

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Anansix

USA . 980 parts In-Stock

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Vyrian

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ACDS - Activité Composants Distribution Service

France . 115 parts In-Stock

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Holdelec - ElecDif-Pro

France . 115 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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ECAB

Sweden . 45 parts In-Stock

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ABC Electronics Ltd.

UK . 10 parts In-Stock

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LittleDiode

UK . 8 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 765 parts In-Stock

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$2.204

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$1.984

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765

$2.204

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Aztec Data Supply Inc.

USA . 1,206 parts In-Stock

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$2.490

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Corohmni

South Africa . 478 parts In-Stock

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$2.924

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MKK Technologies

India . 174 parts In-Stock

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$4.145

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DigiPath Technology Company

USA . 174 parts In-Stock

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$4.145

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Semicontronic

India . 1,487 parts In-Stock

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$9.100

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$8.872

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$8.827

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AZTECH Wire

Italy . 280 parts In-Stock

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$19.064

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Ampacity Inc.

Singapore . 1,153 parts In-Stock

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Lixinc

USA . 15,978 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Continental Prestige Electronics

USA . 2,692 parts In-Stock

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Parana Technologies

USA . 2,375 parts In-Stock

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RC Electronics

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Corphita

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Argo Parts USA

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Bastille Electronics

Australia . 15 parts In-Stock

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Overview

Unlock the power of reliable and efficient electrical control with the BTB26-600B by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality and performance in every product. The BTB26-600B falls under the category of Triode For Alternating Current (TRIAC), making it ideal for various applications. With a maximum RMS On-state Current of 30A and a Repetitive Peak Off-state Voltage of 600V, this TRIAC ensures smooth operation and durability. Trust in STMicroelectronics to provide you with the value, benefits, and advantages you need for your electrical projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this TRIAC lightweight and durable, ideal for various applications.

Maximum DC Gate Trigger Current: 50 mA

With a high maximum DC gate trigger current, this TRIAC is capable of handling a wide range of triggering currents, ensuring reliable performance.

Configuration: SINGLE

The single configuration of this TRIAC simplifies installation and reduces complexity in circuit design, making it user-friendly.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into different systems and provides efficient heat dissipation, enhancing the overall performance of the device.

Terminal Form: THROUGH-HOLE

The through-hole terminal form enables secure and stable connections, ensuring consistent performance in various operating conditions.

Maximum Leakage Current: 3 mA

The low maximum leakage current of 3 mA ensures minimal power loss and enhanced efficiency, making this TRIAC a cost-effective choice.

No. of Terminals: 3

With three terminals, this TRIAC offers versatility in circuit configurations and connections, increasing its compatibility with different systems.

Package Style (Meter): FLANGE MOUNT

The flange mount package style facilitates easy mounting and installation, saving time and effort during assembly.

Maximum Operating Temperature: 110 °C

The high maximum operating temperature of 110°C enables this TRIAC to withstand harsh environmental conditions, ensuring reliability in challenging applications.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4-quadrant logic level design of this TRIAC allows for efficient control and precise triggering, making it suitable for a wide range of industrial and commercial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extreme cold environments, making this TRIAC a versatile choice for various applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent conductivity and corrosion resistance, ensuring long-lasting performance and reliability in demanding conditions.

Terminal Position: SINGLE

The single terminal position simplifies wiring and reduces the risk of errors during installation, making this TRIAC user-friendly and easy to integrate into different systems.

Maximum RMS On-state Current: 30 A

With a maximum RMS on-state current of 30 A, this TRIAC can handle high current loads with ease, making it suitable for power control applications.

Maximum DC Gate Trigger Voltage: 3 V

The low maximum DC gate trigger voltage of 3 V allows for efficient triggering and precise control, enhancing the overall performance of this TRIAC.

Repetitive Peak Off-state Voltage: 600 V

The high repetitive peak off-state voltage of 600 V ensures safe and reliable operation in high-voltage applications, making this TRIAC a secure choice for various systems.

Minimum Critical Rate of Rise of Off-state Voltage: 150 V/us

The minimum critical rate of rise of off-state voltage of 150 V/us prevents voltage spikes and ensures stable operation, making this TRIAC suitable for sensitive electronic equipment.

Maximum Holding Current: 80 mA

With a maximum holding current of 80 mA, this TRIAC offers stable operation and reliable switching performance, making it an excellent choice for high-power applications.

Technical Specifications

Triode For Alternating Current (TRIAC) BTB26-600B attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

150 V/us

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

3 V

Maximum Holding Current:

80 mA

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

3 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

30 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

BTB26-600B Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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