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BTB20-600BW

STMicroelectronics

BTB20-600BW by STMicroelectronics

BTB20-600BW by STMicroelectronics is a single TRIAC with 3 terminals, capable of handling up to 20A RMS current and 600V off-state voltage. It operates b/w -40 °C to 125°C, making it suitable for various applications requiring snubberless TRIACs with UL recognition.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,164 parts In-Stock

1+ parts

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4,164

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Digiode

USA . 3,710 parts In-Stock

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3,710

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Anansix

USA . 1,141 parts In-Stock

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1,141

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 535 parts In-Stock

1+ parts

$1.414

100+ parts

-

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535

$1.414

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Northwest PG Solutions

USA . 562 parts In-Stock

1+ parts

$1.555

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-

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562

$1.555

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IDEA Electronic Components Group

UK . 1,080 parts In-Stock

1+ parts

$2.651

100+ parts

-

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$2.386

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1,080

$2.651

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$2.386

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MKK Technologies

India . 1,508 parts In-Stock

1+ parts

$4.986

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1,508

$4.986

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DigiPath Technology Company

USA . 1,508 parts In-Stock

1+ parts

$4.986

100+ parts

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1,508

$4.986

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Kepictronics

USA . 56,000 parts In-Stock

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56,000

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Parana Technologies

USA . 626 parts In-Stock

1+ parts

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$3.170

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626

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$3.170

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Corphita

USA . 546 parts In-Stock

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546

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Overview

Discover the BTB20-600BW by STMicroelectronics, a high-quality TRIAC designed to deliver reliable performance in a wide range of applications. Manufactured by industry leader STMicroelectronics, this product offers exceptional value and benefits to customers seeking a robust and efficient solution for their electronic projects. With its snubberless design and UL recognized reference standard, the BTB20-600BW is ideal for controlling AC power in various devices, making it a versatile and indispensable component for your next project. Experience the advantages of superior quality and performance with the BTB20-600BW from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components, ensuring a longer lifespan for the product.

Maximum DC Gate Trigger Current: 50 mA

Allows for precise control over the switching of the triode, making it suitable for a variety of applications.

Configuration: SINGLE

Simplifies the design and operation of the triode, making it easier to integrate into circuits.

Package Shape: RECTANGULAR

Facilitates easy mounting and placement of the triode within electronic devices.

Terminal Form: THROUGH-HOLE

Enables secure connections to other electronic components, ensuring reliable performance.

Maximum Repetitive Peak Off-state Leakage Current: 10 uA

Ensures minimal power loss when the triode is in the off-state, improving energy efficiency.

No. of Terminals: 3

Offers a simple and straightforward connection setup for the triode in circuits.

Package Style (Meter): FLANGE MOUNT

Provides a stable and secure mounting option for the triode in electronic devices.

Maximum Operating Temperature: 125 °C

Allows the triode to operate efficiently in a wide range of temperature conditions.

Minimum Operating Temperature: -40 °C

Ensures the triode can function reliably even in cold temperature environments.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant finish for the terminals, ensuring long-lasting performance.

Terminal Position: SINGLE

Simplifies the installation process and ensures proper alignment of the triode in circuits.

Maximum RMS On-state Current: 20 A

Supports high current applications, making it suitable for a wide range of electronic devices.

Maximum DC Gate Trigger Voltage: 1.5 V

Provides a low voltage requirement for triggering the triode, reducing power consumption.

Repetitive Peak Off-state Voltage: 600 V

Offers a high voltage tolerance, making the triode suitable for various power applications.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

Ensures fast response times and reliable operation of the triode in high-speed circuits.

Maximum Holding Current: 75 mA

Ensures stable operation of the triode in the on-state, preventing false triggers.

Reference Standard: UL RECOGNIZED

Meets industry safety standards, ensuring the triode is safe to use in electronic devices.

Technical Specifications

Triode For Alternating Current (TRIAC) BTB20-600BW attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

75 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

20 A

Reference Standard:

UL RECOGNIZED

Maximum Repetitive Peak Off-state Leakage Current:

10 uA

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

BTB20-600BW Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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