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BTB20-400BW

STMicroelectronics

BTB20-400BW by STMicroelectronics

STMicroelectronics' BTB20-400BW is a single TRIAC with 20A RMS current and 400V repetitive peak off-state voltage. It operates b/w -40 to 125 °C, ideal for snubberless applications requiring up to 50mA DC gate trigger current. The package style is flange mount with matte tin finish, suitable for through-hole mounting in various AC control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,369 parts In-Stock

1+ parts

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2,369

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Digiode

USA . 603 parts In-Stock

1+ parts

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603

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Vyrian

USA . 39 parts In-Stock

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39

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Distributors (Availability)

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Northwest PG Solutions

USA . 504 parts In-Stock

1+ parts

$2.574

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504

$2.574

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IDEA Electronic Components Group

UK . 1,274 parts In-Stock

1+ parts

$3.654

100+ parts

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$3.289

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1,274

$3.654

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$3.289

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MKK Technologies

India . 2,043 parts In-Stock

1+ parts

$6.872

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2,043

$6.872

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DigiPath Technology Company

USA . 2,043 parts In-Stock

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$6.872

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2,043

$6.872

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Parana Technologies

USA . 1,544 parts In-Stock

1+ parts

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$4.369

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1,544

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$4.369

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Corphita

USA . 809 parts In-Stock

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809

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Native Components

USA . 625 parts In-Stock

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$2.270

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625

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$2.270

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Overview

Get ready to revolutionize your electrical applications with the BTB20-400BW by STMicroelectronics. Designed with precision and quality in mind, this TRIAC offers unparalleled performance and reliability. Perfect for a wide range of AC power control applications, this product provides exceptional value, benefits, and advantages to customers looking for a high-quality solution. Trust in STMicroelectronics to deliver cutting-edge technology that exceeds expectations. Upgrade your projects today with the BTB20-400BW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the Triode, ensuring longevity and reliability.

Maximum DC Gate Trigger Current: 50 mA

Higher gate trigger current allows for efficient and reliable switching of the Triode, ensuring proper functionality under various operating conditions.

Configuration: SINGLE

Single configuration simplifies the setup and integration of the Triode into electronic circuits, making it user-friendly for both professionals and hobbyists.

Package Shape: RECTANGULAR

Rectangular shape offers easy mounting and fitting options in electronic circuits, saving space and facilitating efficient design layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering during installation, ensuring stable and reliable performance of the Triode.

Maximum Repetitive Peak Off-state Leakage Current: 10 uA

Low off-state leakage current reduces power consumption and heat generation, making the Triode energy-efficient and suitable for high-performance applications.

No. of Terminals: 3

Having three terminals allows for proper connections and controls, enabling the Triode to function effectively in AC circuits and switching applications.

Package Style (Meter): FLANGE MOUNT

Flange mount design offers secure mounting options and efficient heat dissipation, improving the overall reliability and performance of the Triode.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the Triode can withstand harsh environmental conditions and operate reliably in demanding applications without overheating.

Trigger Device Type: SNUBBERLESS TRIAC

Snubberless design eliminates the need for additional components and simplifies the circuit layout, making the Triode more cost-effective and easier to integrate.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the Triode to operate efficiently in cold environments, making it suitable for a wide range of applications in various climates.

Terminal Finish: MATTE TIN

Matte tin finish on terminals provides excellent conductivity and corrosion resistance, ensuring stable connections and long-term performance of the Triode.

Terminal Position: SINGLE

Single terminal position facilitates easy installation and connections, reducing the chances of errors and ensuring the Triode functions correctly in the circuit.

Maximum RMS On-state Current: 20 A

High RMS on-state current rating allows the Triode to handle large loads and high power applications, making it suitable for industrial and commercial use.

Maximum DC Gate Trigger Voltage: 1.5 V

Low gate trigger voltage ensures smooth and reliable switching operations, reducing power consumption and heat dissipation in the Triode.

Repetitive Peak Off-state Voltage: 400 V

High off-state voltage rating allows the Triode to withstand high voltages and surge currents, making it ideal for use in AC power control and switching applications.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

High rate of rise of off-state voltage enables fast and precise switching of the Triode, ensuring optimal performance and response time in rapidly changing load conditions.

Maximum Holding Current: 75 mA

High holding current rating ensures the Triode remains in the conducting state under various conditions, preventing accidental turn-off and maintaining circuit stability.

Technical Specifications

Triode For Alternating Current (TRIAC) BTB20-400BW attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

75 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

20 A

Maximum Repetitive Peak Off-state Leakage Current:

10 uA

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

BTB20-400BW Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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