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BTB20-600CW

STMicroelectronics

BTB20-600CW by STMicroelectronics

BTB20-600CW by STMicroelectronics is a single TRIAC with 20A RMS on-state current, 600V repetitive peak off-state voltage, and 35mA max DC gate trigger current. It is used in snubberless TRIAC applications for AC power control at temperatures ranging from -40 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,392 parts In-Stock

1+ parts

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3,392

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Anansix

USA . 1,280 parts In-Stock

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1,280

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Digiode

USA . 1,111 parts In-Stock

1+ parts

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1,111

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 392 parts In-Stock

1+ parts

$2.865

100+ parts

-

1k+ parts

$2.578

10k+ parts

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392

$2.865

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$2.578

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MKK Technologies

India . 703 parts In-Stock

1+ parts

$5.387

100+ parts

-

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703

$5.387

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DigiPath Technology Company

USA . 703 parts In-Stock

1+ parts

$5.387

100+ parts

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703

$5.387

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Northwest PG Solutions

USA . 2,170 parts In-Stock

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2,170

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Parana Technologies

USA . 1,695 parts In-Stock

1+ parts

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100+ parts

$3.425

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1,695

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$3.425

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Native Components

USA . 823 parts In-Stock

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823

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Corphita

USA . 700 parts In-Stock

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700

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Overview

Unlock the power of reliable and efficient switching with the BTB20-600CW by STMicroelectronics. Designed with high-quality materials and precision engineering, this TRIAC offers unparalleled performance and durability. Ideal for a wide range of applications, from home appliances to industrial machinery, this product delivers seamless operation and peace of mind. Trust in STMicroelectronics to provide you with the cutting-edge technology you need to succeed. Experience the value and benefits that the BTB20-600CW brings to your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to external factors, ensuring a longer lifespan for the product.

Maximum DC Gate Trigger Current: 35 mA

With a high maximum DC Gate Trigger Current, this TRIAC can reliably trigger the gate at lower current levels, allowing for efficient control and operation.

Configuration: SINGLE

The single configuration simplifies the wiring and installation process, making it easier to integrate this TRIAC into different systems.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and mounting of the TRIAC in various applications, optimizing space utilization.

Terminal Form: THROUGH-HOLE

The through-hole terminal form makes it convenient for manual soldering and ensures secure connections, enhancing the overall reliability of the product.

Maximum Repetitive Peak Off-state Leakage Current: 10 uA

The low Off-state Leakage Current minimizes power loss and improves energy efficiency, making this TRIAC a cost-effective choice for long-term usage.

No. of Terminals: 3

Having 3 terminals simplifies the connection process and provides flexibility in circuit design, catering to a wide range of applications.

Package Style: FLANGE MOUNT

The flange mount package style allows for easy and secure mounting on a surface, providing stability and ease of installation.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this TRIAC can withstand harsh environmental conditions and perform reliably in a wide range of temperature settings.

Trigger Device Type: SNUBBERLESS TRIAC

Being a snubberless TRIAC, it reduces electromagnetic interference and improves efficiency in switching operations, ensuring smooth performance in various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this TRIAC to function effectively in cold environments, enhancing its versatility and reliability in different conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability and corrosion resistance, ensuring a strong and durable connection for long-lasting performance.

Terminal Position: SINGLE

The single terminal position simplifies the installation process and ensures proper alignment during connection, making it user-friendly and convenient to use.

Maximum RMS On-state Current: 20 A

With a high maximum RMS On-state Current, this TRIAC can handle substantial power loads, making it suitable for high-current applications that require reliable switching.

Maximum DC Gate Trigger Voltage: 1.5 V

The low maximum DC Gate Trigger Voltage ensures efficient gate triggering at low voltage levels, enabling precise control and reliable operation in various circuits.

Repetitive Peak Off-state Voltage: 600 V

The high Repetitive Peak Off-state Voltage capability allows this TRIAC to handle high voltage applications, making it suitable for a wide range of power control systems.

Minimum Critical Rate of Rise of Off-state Voltage: 250 V/us

The high minimum Critical Rate of Rise of Off-state Voltage ensures fast and reliable switching performance, reducing the risk of voltage fluctuations and enhancing the overall stability of the system.

Maximum Holding Current: 50 mA

With a high maximum Holding Current, this TRIAC can maintain its ON-state even after the gate signal is removed, ensuring stable operation and reducing the risk of unintended switching.

Reference Standard: UL RECOGNIZED

Being UL Recognized, this product meets safety and quality standards, providing assurance of its reliability and compliance with industry regulations.

Technical Specifications

Triode For Alternating Current (TRIAC) BTB20-600CW attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

250 V/us

Maximum DC Gate Trigger Current:

35 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

50 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

20 A

Reference Standard:

UL RECOGNIZED

Maximum Repetitive Peak Off-state Leakage Current:

10 uA

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

BTB20-600CW Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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