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BTB20-600BW/F3

STMicroelectronics

BTB20-600BW/F3 by STMicroelectronics

STMicroelectronics BTB20-600BW/F3 is a single TRIAC with 20A RMS current, 600V repetitive peak off-state voltage, and 50mA DC gate trigger current. It's a snubberless TRIAC ideal for AC applications like motor control and lighting due to its high operating temperature range of -40 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,635 parts In-Stock

1+ parts

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2,635

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Digiode

USA . 1,202 parts In-Stock

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1,202

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Vyrian

USA . 194 parts In-Stock

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194

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 582 parts In-Stock

1+ parts

$2.981

100+ parts

-

1k+ parts

$2.683

10k+ parts

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582

$2.981

-

$2.683

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MKK Technologies

India . 1,730 parts In-Stock

1+ parts

$5.605

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1,730

$5.605

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DigiPath Technology Company

USA . 1,730 parts In-Stock

1+ parts

$5.605

100+ parts

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1,730

$5.605

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Parana Technologies

USA . 2,345 parts In-Stock

1+ parts

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$3.564

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2,345

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$3.564

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Corphita

USA . 1,443 parts In-Stock

1+ parts

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1,443

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Native Components

USA . 761 parts In-Stock

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761

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Northwest PG Solutions

USA . 584 parts In-Stock

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584

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Overview

Unlock the power of reliable and high-quality electrical control with the BTB20-600BW/F3 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics ensures top-notch performance and durability in every product. This TRIAC device is perfect for a wide range of applications where precise AC control is essential. With its snubberless design and impressive specs, customers can trust in the value and benefits this product brings to their projects. Upgrade your system today with the BTB20-600BW/F3 and experience the advantage of superior quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the triode, ensuring a longer lifespan.

Maximum DC Gate Trigger Current: 50 mA

Allows for reliable triggering of the triode, ensuring smooth operation without the risk of false triggers.

Configuration: SINGLE

Simplified design with a single configuration makes installation and integration easier.

Surface Mount: YES

Enables easy and space-efficient mounting on circuit boards, ideal for compact electronic devices.

Maximum Repetitive Peak Off-state Leakage Current: 10 uA

Low leakage current helps in reducing power consumption and enhancing efficiency.

No. of Terminals: 2

Simple two-terminal design simplifies connection and reduces complexity in the circuit.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures stable performance even under challenging conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in both hot and cold environments.

Maximum RMS On-state Current: 20 A

High current rating allows the triode to handle heavy loads and prevent overheating.

Maximum DC Gate Trigger Voltage: 1.5 V

Low trigger voltage ensures efficient and reliable triggering of the triode.

Repetitive Peak Off-state Voltage: 600 V

High off-state voltage rating makes the triode suitable for high voltage applications.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

Fast rate of rise ensures quick response to changes in voltage, enhancing safety and protection.

Maximum Holding Current: 75 mA

Sufficient holding current ensures the triode stays in the on-state even under varying conditions.

Technical Specifications

Triode For Alternating Current (TRIAC) BTB20-600BW/F3 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

75 mA

JESD-30 Code:

R-PSFM-G2

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

20 A

Maximum Repetitive Peak Off-state Leakage Current:

10 uA

Repetitive Peak Off-state Voltage:

600 V

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

BTB20-600BW/F3 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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