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BTB20-400BW/F5

STMicroelectronics

BTB20-400BW/F5 by STMicroelectronics

STMicroelectronics' BTB20-400BW/F5 is a single TRIAC with 3 terminals, max. RMS on-state current of 20A, and trigger voltage of 1.5V. It operates b/w -40 to 125 °C, ideal for snubberless applications in AC circuits requiring up to 400V repetitive peak off-state voltage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,738 parts In-Stock

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2,738

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Digiode

USA . 2,260 parts In-Stock

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2,260

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Vyrian

USA . 188 parts In-Stock

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188

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 246 parts In-Stock

1+ parts

$3.283

100+ parts

-

1k+ parts

$2.955

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246

$3.283

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$2.955

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MKK Technologies

India . 272 parts In-Stock

1+ parts

$6.174

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272

$6.174

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DigiPath Technology Company

USA . 272 parts In-Stock

1+ parts

$6.174

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272

$6.174

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Corphita

USA . 3,667 parts In-Stock

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3,667

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Parana Technologies

USA . 2,350 parts In-Stock

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$3.926

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2,350

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$3.926

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Northwest PG Solutions

USA . 2,030 parts In-Stock

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2,030

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Native Components

USA . 238 parts In-Stock

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238

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Overview

Discover the BTB20-400BW/F5 by STMicroelectronics, a top-quality Triode for Alternating Current (TRIAC) designed to meet all your electrical control needs. With a reputation for excellence and reliability, STMicroelectronics delivers superior performance in a durable plastic/epoxy package. Ideal for a wide range of applications, this single-configured TRIAC offers a maximum RMS on-state current of 20A and a repetitive peak off-state voltage of 400V, providing unmatched value and benefits to customers seeking efficiency and precision in their electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures the product's longevity and ease of handling.

Maximum DC Gate Trigger Current: 50 mA

Allows for precise control and triggering of the device.

Configuration: SINGLE

Simplified design for easy integration into circuits.

Package Shape: RECTANGULAR

Space-efficient shape for fitting into compact areas.

Terminal Form: THROUGH-HOLE

Ideal for through-hole PCB mounting for secure and stable connections.

Maximum Repetitive Peak Off-state Leakage Current: 10 uA

Ensures minimal power loss when the device is in the off-state.

No. of Terminals: 3

Simple and straightforward connection setup.

Package Style (Meter): FLANGE MOUNT

Secure mounting option for stability in applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range for diverse use cases.

Trigger Device Type: SNUBBERLESS TRIAC

Provides improved performance and reliability with snubberless technology.

Minimum Operating Temperature: -40 °C

Allows for operation in extreme temperature conditions.

Terminal Position: SINGLE

Simplified terminal layout for easy connection.

Maximum RMS On-state Current: 20 A

Capable of handling high currents for various applications.

Maximum DC Gate Trigger Voltage: 1.5 V

Low trigger voltage for efficient control and operation.

Repetitive Peak Off-state Voltage: 400 V

Provides high voltage protection in off-state conditions.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

Quick response to voltage changes for reliable operation.

Maximum Holding Current: 75 mA

Maintains device state without triggering for stable operation.

Technical Specifications

Triode For Alternating Current (TRIAC) BTB20-400BW/F5 attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

75 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

20 A

Maximum Repetitive Peak Off-state Leakage Current:

10 uA

Repetitive Peak Off-state Voltage:

400 V

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

BTB20-400BW/F5 Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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