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LV8702V-MPB-H

Onsemi

LV8702V-MPB-H by Onsemi

LV8702V-MPB-H by Onsemi is a Motion Control IC with 24V supply, 3A output current, and BCDMOS technology. Ideal for stepper motor control applications in industrial settings due to its compact size, low profile design, and wide operating temperature range from -40 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,225 parts In-Stock

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Digiode

USA . 1,160 parts In-Stock

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AZTECH Wire

Italy . 985 parts In-Stock

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$18.130

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985

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Kulean Microsystems

USA . 2,561 parts In-Stock

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UHIMA Technologies

Türkiye . 740 parts In-Stock

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Problanco Electronics

Mexico . 661 parts In-Stock

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Corphita

USA . 441 parts In-Stock

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Microchip USA

USA . 410 parts In-Stock

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TANS Electronics

Latvia . 371 parts In-Stock

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SupplyDigital Components

Austria . 260 parts In-Stock

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Corohmni

South Africa . 123 parts In-Stock

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Overview

Elevate your motion control systems with the LV8702V-MPB-H by Onsemi. Crafted with precision and expertise, this compact stepper motor controller offers unparalleled quality and reliability. Designed for industrial applications, this IC boasts a range of benefits including a nominal supply voltage of 24V, maximum output current of 3A, and a wide temperature operating range. Experience seamless integration and enhanced performance with the LV8702V-MPB-H, setting new standards in motion control technology. Elevate your systems today with Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components of the IC.

Surface Mount: YES

Surface mount technology makes it easier to integrate this IC into a variety of electronic devices.

Nominal Supply Voltage (Vsup): 24 V

Compatible with a common supply voltage in many industrial applications.

No. of Terminals: 44

Plenty of terminals for connecting to external circuitry.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

Technology: BCDMOS

BCDMOS technology offers low power consumption and fast operation.

Technical Specifications

Motion Control ICs LV8702V-MPB-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e6

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP44,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

6.5 mA

Maximum Supply Voltage (Vsup):

32 V

Minimum Supply Voltage (Vsup):

9 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.6 mm

Trade Compliance

LV8702V-MPB-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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