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LC87F7DJ2CVUEM2H

Onsemi

LC87F7DJ2CVUEM2H by Onsemi

LC87F7DJ2CVUEM2H by Onsemi is an 8-bit microcontroller with 196608 ROM words and 8192 RAM bytes. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications. With a max supply current of 15.6 mA, this CMOS technology-based microcontroller is ideal for various electronic devices requiring low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 34,000 parts In-Stock

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Vyrian

USA . 13,287 parts In-Stock

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Digiode

USA . 2,138 parts In-Stock

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AZTECH Wire

Italy . 1,159 parts In-Stock

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$21.670

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Component Stockers USA

USA . 523 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 8,167 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,983 parts In-Stock

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Problanco Electronics

Mexico . 6,555 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,583 parts In-Stock

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SupplyDigital Components

Austria . 5,256 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,655 parts In-Stock

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TANS Electronics

Latvia . 3,058 parts In-Stock

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UHIMA Technologies

Türkiye . 799 parts In-Stock

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Kepictronics

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Corohmni

South Africa . 417 parts In-Stock

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Microchip USA

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Overview

Discover the LC87F7DJ2CVUEM2H by Onsemi, a top-of-the-line microcontroller that boasts superior quality and reliability. With Onsemi's reputation for excellence in manufacturing, this product is sure to exceed your expectations. Ideal for a wide range of applications, this microcontroller offers unmatched value and benefits to customers. From its innovative technology to its industrial-grade temperature tolerance, the LC87F7DJ2CVUEM2H delivers exceptional performance and reliability, making it the perfect choice for your next project. Elevate your designs with this cutting-edge microcontroller from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good durability and protection for the microcontroller, making it suitable for various environmental conditions.

Surface Mount: YES

This feature allows for easy and convenient installation onto circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape provides a compact form factor, ideal for space-constrained designs.

Bit Size: 8

An 8-bit microcontroller is suitable for many basic applications and can offer a cost-effective solution.

Power Supplies (V): 3/3.3

Support for multiple power supply options gives flexibility in designing and integrating the microcontroller into different systems.

No. of Terminals: 100

Having a high number of terminals allows for greater connectivity options and interfacing with other components.

Package Style (Meter): FLATPACK

The flatpack style offers a low profile and can enhance thermal performance, making it suitable for applications with space and heat constraints.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low operating temperature range makes this microcontroller suitable for use in colder environments or applications.

Terminal Finish: Tin/Bismuth (Sn/Bi)

This finish provides good solderability and ensures stable electrical connections, enhancing the reliability of the product.

Terminal Position: QUAD

The quad terminal position offers improved stability and mechanical strength, making it suitable for applications where vibration or movement is a concern.

ROM Words: 196608

With a large ROM capacity, this microcontroller can store a significant amount of program data, making it suitable for complex applications.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in demanding industrial environments.

RAM Bytes: 8192

An ample amount of RAM allows for efficient data processing and storage, making this microcontroller suitable for multitasking applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and ease of soldering, ensuring a robust connection in applications subject to mechanical stress.

Maximum Supply Current: 15.6 mA

The low supply current enables energy-efficient operation, making this microcontroller suitable for battery-powered or low-power applications.

ROM Programmability: FLASH

Flash programmability allows for easy and quick updates to the program memory, enabling flexibility and future-proofing of the product.

Terminal Pitch: 0.635 mm

The fine terminal pitch offers high-density packaging and allows for space-saving design layouts, making it suitable for compact electronic devices.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that this microcontroller has a moderate level of sensitivity to moisture, making it suitable for application environments with controlled humidity levels.

Technical Specifications

Microcontrollers LC87F7DJ2CVUEM2H attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

Bit Size:

8

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

196608

ROM Programmability:

FLASH

Sub-Category:

Microcontrollers

Maximum Supply Current:

15.6 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Trade Compliance

LC87F7DJ2CVUEM2H Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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