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LC872G06A(MFP24S)

Onsemi

LC872G06A(MFP24S) by Onsemi

LC872G06A(MFP24S) by Onsemi is an 8-bit microcontroller with 24 terminals, operating at -40 to 85 °C. It features 256 bytes of RAM, 6144 ROM words, and PWM channels for industrial applications requiring a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,127 parts In-Stock

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Vyrian

USA . 798 parts In-Stock

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Problanco Electronics

Mexico . 5,935 parts In-Stock

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SupplyDigital Components

Austria . 4,608 parts In-Stock

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Kulean Microsystems

USA . 3,394 parts In-Stock

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Corphita

USA . 1,923 parts In-Stock

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TANS Electronics

Latvia . 649 parts In-Stock

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Corohmni

South Africa . 346 parts In-Stock

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UHIMA Technologies

Türkiye . 244 parts In-Stock

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Overview

Unleash the power of innovation with the LC872G06A(MFP24S) by Onsemi! As a leading manufacturer in the industry, Onsemi delivers top-quality microcontrollers that offer unmatched performance and reliability. Ideal for a wide range of applications, this product provides customers with valuable benefits such as high-speed operation, efficient power management, and versatile functionality. Whether you're designing smart home devices, automotive systems, or industrial automation solutions, the LC872G06A(MFP24S) is the perfect choice to bring your projects to life. Upgrade to Onsemi today and experience the difference in quality and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and widely used in electronics manufacturing, making the product affordable and easily accessible.

Surface Mount: YES

Surface mount technology allows for more compact and lightweight designs, making the product suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage provides flexibility in power supply options and compatibility with a wide range of peripherals.

Bit Size: 8

An 8-bit microcontroller is sufficient for many basic applications and offers a good balance between performance and cost.

RAM Bytes: 256

With adequate RAM capacity, the product can handle multitasking and data processing efficiently without running out of memory.

ADC Channels: YES

Having Analog-to-Digital Converter channels allows the microcontroller to interface with analog sensors and signals, expanding its range of applications.

ROM Programmability: MROM

Mask ROM (MROM) provides permanent storage for firmware, ensuring stability and security in embedded systems.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity, making the product reliable and energy-efficient.

Technical Specifications

Microcontrollers LC872G06A(MFP24S) attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

Length:

12.5 mm

No. of I/O Lines:

19

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.3,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

6144

ROM Programmability:

MROM

Speed:

24.4 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Width:

5.4 mm

Peripheral IC Type:

Trade Compliance

LC872G06A(MFP24S) Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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