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LC872G08A

Onsemi

LC872G08A by Onsemi

The Onsemi LC872G08A is an 8-bit microcontroller with a max clock frequency of 24.4 MHz, suitable for industrial applications. It features 19 I/O lines, PWM channels, and ADC channels, operating in a temperature range from -40 °C to 85°C. The compact package style and low profile make it ideal for space-constrained designs requiring high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 325 parts In-Stock

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Vyrian

USA . 58 parts In-Stock

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TANS Electronics

Latvia . 7,357 parts In-Stock

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Kulean Microsystems

USA . 7,312 parts In-Stock

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Problanco Electronics

Mexico . 3,866 parts In-Stock

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SupplyDigital Components

Austria . 1,891 parts In-Stock

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UHIMA Technologies

Türkiye . 679 parts In-Stock

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679

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Corohmni

South Africa . 219 parts In-Stock

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Corphita

USA . 59 parts In-Stock

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Overview

Unleash the power of innovation with the LC872G08A by Onsemi, a top-notch microcontroller that offers unparalleled performance and reliability. Manufactured by the trusted name in the industry, Onsemi, this cutting-edge product is perfect for a wide range of applications. From smart home devices to automotive systems, the LC872G08A delivers exceptional value, efficiency, and flexibility. Say goodbye to limitations and hello to endless possibilities with this state-of-the-art microcontroller. Upgrade your projects today and experience the difference with the LC872G08A.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and enabling efficient assembly processes.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this microcontroller can handle higher voltages without risk of damage.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy placement and orientation on the PCB, enhancing ease of use in designs.

Bit Size: 8

8-bit architecture provides a good balance between cost and performance, suitable for a wide range of embedded applications.

ADC Channels: YES

Presence of ADC channels enables analog-to-digital conversion, allowing the microcontroller to interface with a variety of sensors and devices.

Maximum Clock Frequency: 24.4 MHz

High clock frequency allows for fast processing and response times, making the microcontroller suitable for applications requiring quick data processing.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation across a wide temperature range, making the microcontroller suitable for industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy efficient and reliable in noisy environments.

PWM Channels: YES

PWM channels enable precise control of analog devices such as motors and LEDs, enhancing the versatility of the microcontroller for various applications.

Technical Specifications

Microcontrollers LC872G08A attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Additional Features:

ALSO AVAILABLE IN MFP 24 PACKAGE

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

24.4 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

Length:

6.5 mm

No. of I/O Lines:

19

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Qualification:

Not Qualified

ROM Programmability:

MROM

Maximum Seated Height:

1.5 mm

Speed:

12 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

LC872G08A Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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