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LC871H96A

Onsemi

LC871H96A by Onsemi

The Onsemi LC871H96A is an 8-bit microcontroller with 48 terminals, operating b/w -40 to 85 °C. Featuring 16384 RAM bytes and 98304 ROM words, it's ideal for industrial applications requiring a CMOS technology-based peripheral IC type. With a max supply current of 35 mA and speed of 12 rpm, this surface-mount device in a square package is suitable for various electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,759 parts In-Stock

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Digiode

USA . 1,111 parts In-Stock

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Problanco Electronics

Mexico . 8,194 parts In-Stock

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SupplyDigital Components

Austria . 2,614 parts In-Stock

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Kulean Microsystems

USA . 2,495 parts In-Stock

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TANS Electronics

Latvia . 1,145 parts In-Stock

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Corohmni

South Africa . 413 parts In-Stock

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Corphita

USA . 301 parts In-Stock

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UHIMA Technologies

Türkiye . 227 parts In-Stock

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Overview

Revolutionize your electronic projects with the LC871H96A by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. This microcontroller offers endless possibilities for applications in various industries, providing customers with unparalleled value and benefits. With its advanced technology and high-performance features, the LC871H96A is the perfect choice for those looking to take their projects to the next level. Trust Onsemi to deliver exceptional products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Being surface mountable makes the microcontroller easy to install on circuit boards, saving space and making assembly more efficient.

Bit Size: 8

An 8-bit microcontroller is suitable for many general-purpose applications and can handle a wide range of tasks effectively.

Power Supplies (V): 3/5

The microcontroller can be powered using either 3V or 5V, providing flexibility in design and compatibility with various power sources.

No. of Terminals: 48

With a high number of terminals, the microcontroller can interface with multiple external devices, expanding its capabilities in a system.

Maximum Operating Temperature: 85 °C

The microcontroller can operate reliably at high temperatures, suitable for industrial applications where heat may be a concern.

ROM Words: 98304

The large ROM capacity allows for storing a significant amount of program data and firmware, enabling complex functions and applications.

RAM Bytes: 16384

With ample RAM storage, the microcontroller can efficiently process and store data during operation, enhancing its performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Technical Specifications

Microcontrollers LC871H96A attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

Bit Size:

8

JESD-30 Code:

S-PQFP-G48

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

98304

ROM Programmability:

MROM

Speed:

12 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

35 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

LC871H96A Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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