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LC872H04A

Onsemi

LC872H04A by Onsemi

The Onsemi LC872H04A is an 8-bit microcontroller with a max clock frequency of 24.4 MHz and 256 bytes of RAM. It operates in industrial temperature grades, suitable for applications requiring up to 24 PWM channels and ADC functionality. The package style is a low-profile flatpack with a square shape, making it ideal for space-constrained designs.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 1,564 parts In-Stock

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Vyrian

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SupplyDigital Components

Austria . 8,283 parts In-Stock

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Kulean Microsystems

USA . 7,836 parts In-Stock

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TANS Electronics

Latvia . 5,786 parts In-Stock

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Problanco Electronics

Mexico . 1,403 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 622 parts In-Stock

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Corohmni

South Africa . 57 parts In-Stock

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Overview

Unlock the power of innovation with the LC872H04A by Onsemi. As a leader in microcontroller technology, Onsemi delivers top-quality products that exceed industry standards. The LC872H04A is perfect for a wide range of applications due to its versatile features and high-performance capabilities. Experience seamless operation and reliable functionality with this cutting-edge microcontroller. Elevate your projects with Onsemi's commitment to excellence and precision engineering.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage requirements, making it versatile for different applications.

Bit Size: 8

Provides sufficient processing power for a wide range of tasks while being energy-efficient.

Power Supplies (V): 2/5

Supports multiple voltage options, allowing for flexibility in power input.

No. of Terminals: 36

Offers ample connectivity options for interfacing with other components in the system.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the microcontroller to interact with analog sensors and signals.

ROM Words: 4096

Provides sufficient memory for storing program instructions and data.

RAM Bytes: 256

Offers enough random-access memory for temporary data storage and operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliability.

PWM Channels: YES

Supports pulse-width modulation, useful for applications such as motor control and LED dimming.

Technical Specifications

Microcontrollers LC872H04A attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 2.2 V AT 10 MHZ AND 21.8 V AT 4 MHZ

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

24.4 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G36

Length:

7 mm

No. of I/O Lines:

24

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP36,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

MROM

Maximum Seated Height:

1.7 mm

Speed:

24.4 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Trade Compliance

LC872H04A Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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