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LC872G08A(MFP24S)

Onsemi

LC872G08A(MFP24S) by Onsemi

LC872G08A(MFP24S) by Onsemi is an 8-bit microcontroller with 24 terminals, operating at a speed of 24.4 rpm. It features 256 bytes of RAM, 8192 ROM words, and ADC channels for industrial applications. With a package size of 5.4mm x 12.5mm, it supports PWM channels and has a max supply voltage of 5.5V.

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Lifecycle Status

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1k+

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Digiode

USA . 154 parts In-Stock

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Problanco Electronics

Mexico . 5,216 parts In-Stock

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Kulean Microsystems

USA . 5,195 parts In-Stock

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SupplyDigital Components

Austria . 4,842 parts In-Stock

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TANS Electronics

Latvia . 2,744 parts In-Stock

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Corphita

USA . 785 parts In-Stock

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UHIMA Technologies

Türkiye . 671 parts In-Stock

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Overview

Unleash the power of innovation with the LC872G08A(MFP24S) microcontroller by Onsemi. This versatile device offers top-notch quality and reliability, making it ideal for a wide range of applications in various industries. With its compact design, low power consumption, and advanced features, this microcontroller provides unmatched value and benefits to customers looking to enhance their products with cutting-edge technology. Trust Onsemi for superior performance and endless possibilities with the LC872G08A(MFP24S) microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability makes it easier to integrate this microcontroller into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this microcontroller can handle a wide range of power sources, making it versatile for different applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy placement and alignment on circuit boards, optimizing space usage.

Bit Size: 8

The 8-bit size provides a good balance between processing power and cost, suitable for many general-purpose applications.

Power Supplies (V): 2/5

Having options for both 2V and 5V power supplies allows for flexibility in designing and powering the microcontroller.

No. of Terminals: 24

With 24 terminals, this microcontroller offers a sufficient number of connection points for interfacing with other components and peripherals.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures compatibility with a wide range of power sources, making this microcontroller versatile.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller can withstand higher temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40 °C allows this microcontroller to function reliably in cold environments, expanding its usability.

ADC Channels: YES

Analog-to-digital converter (ADC) channels enable the microcontroller to interface with analog sensors and signals, increasing its versatility.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in connection options, enhancing the reliability and ease of use of this microcontroller.

ROM Words: 8192

Having 8192 ROM words allows for storing a significant amount of program data, enabling complex applications to be implemented on this microcontroller.

Width: 5.4 mm

The compact width of 5.4mm makes this microcontroller suitable for space-constrained designs, ideal for compact electronics.

Length: 12.5 mm

The length of 12.5mm is within a reasonable range for most applications, providing a good balance between size and functionality.

Temperature Grade: INDUSTRIAL

Being industrial-grade, this microcontroller is designed to withstand harsh environmental conditions and ensure reliable performance in demanding settings.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller, this product offers integrated peripherals and processing capabilities, simplifying system design and reducing component count.

RAM Bytes: 256

Having 256 RAM bytes provides sufficient memory for storing variables and temporary data, supporting efficient program execution on this microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical connections and ease of soldering, ensuring secure and reliable connections for this microcontroller.

Maximum Supply Current: 11.2 mA

With a maximum supply current of 11.2mA, this microcontroller operates efficiently without excessive power consumption, suitable for battery-powered applications.

PWM Channels: YES

Pulse-width modulation (PWM) channels enable precise control of output signals, making this microcontroller suitable for applications requiring accurate and adjustable outputs.

ROM Programmability: MROM

Mask-programmable read-only memory (MROM) ensures the permanence and security of program code, protecting against unauthorized modifications.

Terminal Pitch: 1 mm

With a terminal pitch of 1mm, this microcontroller is compatible with standard spacing on circuit boards, facilitating easy integration into existing designs.

Speed: 24.4 rpm

With a speed of 24.4 revolutions per minute, this microcontroller offers fast processing capabilities, suitable for real-time control and communication tasks.

No. of I/O Lines: 19

Having 19 input/output lines provides ample connectivity options for interfacing with external devices and sensors, enhancing the versatility of this microcontroller.

Technical Specifications

Microcontrollers LC872G08A(MFP24S) attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

Length:

12.5 mm

No. of I/O Lines:

19

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.3,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

MROM

Speed:

24.4 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Width:

5.4 mm

Peripheral IC Type:

Trade Compliance

LC872G08A(MFP24S) Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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