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LC872G04A(SSOP24)

Onsemi

LC872G04A(SSOP24) by Onsemi

LC872G04A(SSOP24) by Onsemi is an 8-bit microcontroller with 256B RAM, 4096 ROM words, and PWM channels. It operates b/w -40 to 85 °C and has a supply voltage range of 3-5.5V. Ideal for industrial applications requiring a compact form factor and low power consumption.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 2,147 parts In-Stock

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Vyrian

USA . 882 parts In-Stock

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882

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TANS Electronics

Latvia . 6,726 parts In-Stock

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Kulean Microsystems

USA . 6,351 parts In-Stock

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SupplyDigital Components

Austria . 6,264 parts In-Stock

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Problanco Electronics

Mexico . 5,578 parts In-Stock

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Corphita

USA . 1,685 parts In-Stock

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UHIMA Technologies

Türkiye . 921 parts In-Stock

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Corohmni

South Africa . 154 parts In-Stock

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Overview

Unleash the power of innovation with the LC872G04A(SSOP24) microcontroller by Onsemi. Crafted with precision and expertise, this cutting-edge device offers unmatched quality and reliability. Perfect for a wide range of applications, this microcontroller is designed to elevate your projects to new heights. Experience seamless performance and efficiency with advanced features that guarantee unparalleled value and benefits. Trust Onsemi to deliver superior technology that empowers you to create without limits. Elevate your designs with the LC872G04A(SSOP24) and unleash endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material offers durability and protection, making this microcontroller suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable makes it easier to integrate this microcontroller into compact and modern electronic designs.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this microcontroller can handle higher voltage requirements, providing flexibility in power supply options.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and orientation on circuit boards, simplifying the assembly process.

Bit Size: 8

An 8-bit architecture provides sufficient processing power for many embedded applications while being energy-efficient.

Power Supplies (V): 2/5

Supporting multiple power supply options of 2V and 5V allows for compatibility with various power sources and systems.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options for interfacing with other components in the circuit.

Minimum Supply Voltage: 3 V

With a low minimum supply voltage of 3V, this microcontroller can operate efficiently in low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C enables reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures proper functioning even in extreme cold environments.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels allows for interfacing with analog sensors and signals, expanding the range of applications for this microcontroller.

Terminal Position: DUAL

Dual terminal positioning offers increased flexibility in circuit board layout and PCB design.

ROM Words: 4096

With a ROM capacity of 4096 words, this microcontroller can store a significant amount of program code for complex functionalities.

Width: 4.4 mm

The compact width of 4.4mm enables space-saving designs and integration into small form factor devices.

Length: 6.5 mm

The length of 6.5mm further contributes to the overall compactness of the microcontroller, ideal for portable and miniaturized applications.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this microcontroller offers high reliability and performance under demanding operating conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with various built-in peripherals, this product simplifies the design process and reduces the need for external components.

RAM Bytes: 256

With 256 bytes of RAM, this microcontroller can efficiently handle data processing and storage requirements for many embedded systems.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications, making this microcontroller versatile and energy-efficient.

Terminal Form: GULL WING

The gull-wing terminal form factor simplifies soldering and ensures secure connections during PCB assembly.

Maximum Supply Current: 11.2 mA

The low maximum supply current of 11.2 mA indicates efficient power usage, extending battery life and reducing operating costs.

PWM Channels: YES

The presence of Pulse-Width Modulation channels allows for precise control of analog signals, making this microcontroller suitable for applications requiring motor control or LED dimming.

ROM Programmability: MROM

MROM (Mask-Read-Only Memory) ensures secure and permanent storage of essential program code, preventing unauthorized access or modification.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm enhances connectivity density on the PCB, enabling high-performance and compact designs.

Speed: 24.4 rpm

With a processing speed of 24.4 rpm, this microcontroller can efficiently execute tasks and respond to inputs in real-time, ensuring smooth operation of connected devices.

No. of I/O Lines: 19

Having 19 input/output lines offers sufficient interfacing capabilities for connecting sensors, actuators, displays, and communication interfaces in embedded systems.

Technical Specifications

Microcontrollers LC872G04A(SSOP24) attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

Length:

6.5 mm

No. of I/O Lines:

19

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

MROM

Speed:

24.4 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

LC872G04A(SSOP24) Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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