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LC871HC8A

Onsemi

LC871HC8A by Onsemi

The Onsemi LC871HC8A is an 8-bit microcontroller with 131072 ROM words and 16384 RAM bytes. Operating in industrial temperatures from -40 to 85 °C, it has a max supply current of 35mA. Ideal for applications requiring a high-speed CMOS technology microcontroller in a compact flatpack package.

Median Price

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< 1k

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Digiode

USA . 284 parts In-Stock

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Vyrian

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TANS Electronics

Latvia . 4,496 parts In-Stock

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Problanco Electronics

Mexico . 4,252 parts In-Stock

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Kulean Microsystems

USA . 1,804 parts In-Stock

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SupplyDigital Components

Austria . 1,116 parts In-Stock

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UHIMA Technologies

Türkiye . 405 parts In-Stock

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Corohmni

South Africa . 105 parts In-Stock

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Corphita

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Overview

Elevate your projects with the high-quality LC871HC8A microcontroller by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-notch products that guarantee reliability and performance. This versatile microcontroller is perfect for a wide range of applications, offering customers value, efficiency, and convenience. With its advanced technology and user-friendly features, the LC871HC8A is sure to streamline your development process and elevate your designs to the next level. Trust Onsemi for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection for the microcontroller, making it suitable for various environments and applications.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into printed circuit boards, saving space and simplifying the manufacturing process.

Bit Size: 8

With a bit size of 8, this microcontroller is capable of handling smaller tasks efficiently and is ideal for applications that do not require large computational power.

Power Supplies (V): 3/5

The compatibility with both 3V and 5V power supplies provides flexibility in powering the microcontroller, making it compatible with a wide range of applications.

No. of Terminals: 48

The high number of terminals allows for versatile connectivity options and interfaces with other devices, enhancing the functionality and capabilities of the microcontroller.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact and efficient design for the microcontroller, enabling easy installation and integration into electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliability and stability in harsh environmental conditions, making this microcontroller suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows for operation in extreme cold environments, expanding the usability of this microcontroller.

ROM Words: 131072

The large ROM capacity of 131072 words provides ample storage space for program code and data, allowing for complex applications to be implemented on the microcontroller.

RAM Bytes: 16384

The generous RAM size of 16384 bytes enables efficient data processing and temporary storage, enhancing the performance and multitasking capabilities of the microcontroller.

Technology: CMOS

The CMOS technology used in this microcontroller offers low power consumption, high noise immunity, and increased reliability, making it an energy-efficient and robust choice for various applications.

Maximum Supply Current: 35 mA

The maximum supply current of 35 mA ensures efficient power usage and prevents overloading, helping to prolong the lifespan of the microcontroller.

ROM Programmability: MROM

The MROM (Mask ROM) programmability ensures that the program code stored in ROM is secure and cannot be easily altered, providing protection against unauthorized access or tampering.

Speed: 12 rpm

The operating speed of 12 rotations per minute indicates the processing speed and overall performance of the microcontroller, making it suitable for applications requiring real-time data processing and control.

Technical Specifications

Microcontrollers LC871HC8A attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

Bit Size:

8

JESD-30 Code:

S-PQFP-G48

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

MROM

Speed:

12 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

35 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

LC871HC8A Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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