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LC8740B2A

Onsemi

LC8740B2A by Onsemi

The Onsemi LC8740B2A is an 8-bit microcontroller with a max clock frequency of 30.88 MHz, suitable for commercial applications. Featuring 48 I/O lines and PWM channels, it operates b/w -10 °C to 70°C temperature range. With a compact rectangular package style and dual terminal position, it offers versatile integration options in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,472 parts In-Stock

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Digiode

USA . 1,467 parts In-Stock

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1,467

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Problanco Electronics

Mexico . 6,883 parts In-Stock

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TANS Electronics

Latvia . 4,664 parts In-Stock

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Corphita

USA . 1,621 parts In-Stock

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Kulean Microsystems

USA . 1,375 parts In-Stock

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SupplyDigital Components

Austria . 726 parts In-Stock

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UHIMA Technologies

Türkiye . 175 parts In-Stock

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Corohmni

South Africa . 61 parts In-Stock

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Overview

Unlock endless possibilities with the LC8740B2A microcontroller by Onsemi. Crafted with precision and reliability, this powerhouse device boasts a plethora of applications in various industries. From smart home automation to automotive electronics, this versatile microcontroller offers unparalleled value and benefits to customers. Dive into the world of seamless integration and efficiency with Onsemi's cutting-edge technology. Elevate your projects to new heights with the LC8740B2A.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY packages are lightweight and cost-effective, making the microcontroller ideal for applications where weight and cost are important factors.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options and provides a wider operating range for the microcontroller.

Bit Size: 8

8-bit architecture is suitable for a wide range of applications and offers a good balance between processing power and cost.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and signals, expanding its capabilities for various applications.

Maximum Clock Frequency: 30.88 MHz

The high maximum clock frequency enables the microcontroller to perform tasks quickly and efficiently, making it suitable for applications requiring fast processing speeds.

ROM Programmability: MROM

MROM (Mask ROM) programmability ensures that the program code is permanently fixed, enhancing the security and reliability of the microcontroller for critical applications.

Technical Specifications

Microcontrollers LC8740B2A attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Additional Features:

ALSO AVAILABLE IN QIP 64 PACKAGE

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

30.88 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDIP-T64

Length:

57.2 mm

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

ROM Programmability:

MROM

Maximum Seated Height:

5.1 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

15.24 mm

Peripheral IC Type:

Trade Compliance

LC8740B2A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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