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LC872G04A(MFP24S)

Onsemi

LC872G04A(MFP24S) by Onsemi

LC872G04A(MFP24S) by Onsemi is an 8-bit microcontroller with 24 terminals, operating at a speed of 24.4 rpm. It features 256 bytes of RAM, 4096 ROM words, and ADC channels for industrial applications. With a package size of 5.4mm x 12.5mm and PWM channels, it is suitable for compact electronic designs requiring precise control and monitoring capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,885 parts In-Stock

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Digiode

USA . 333 parts In-Stock

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Problanco Electronics

Mexico . 8,028 parts In-Stock

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Kulean Microsystems

USA . 2,801 parts In-Stock

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TANS Electronics

Latvia . 1,210 parts In-Stock

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Corphita

USA . 1,043 parts In-Stock

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UHIMA Technologies

Türkiye . 899 parts In-Stock

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Corohmni

South Africa . 110 parts In-Stock

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SupplyDigital Components

Austria . 53 parts In-Stock

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Overview

Unleash the power of innovation with the LC872G04A(MFP24S) by Onsemi! This cutting-edge microcontroller offers top-notch quality and reliability, thanks to Onsemi's reputation as a leader in the industry. Perfect for a wide range of applications, this product provides unmatched value and benefits to customers seeking superior performance and efficiency. Trust Onsemi to deliver excellence with the LC872G04A(MFP24S) and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring the product is long-lasting and easy to handle.

Surface Mount: YES

Surface mount technology allows for easy installation on PCBs, making the product suitable for compact and space-constrained designs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage tolerance of 5.5 V provides flexibility in power supply options and ensures stable performance under varying voltage conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement and utilization of space on the PCB.

Bit Size: 8

The 8-bit architecture offers a good balance between performance and cost, making the product suitable for a wide range of applications.

Power Supplies (V): 2/5

The dual power supply options of 2V and 5V provide compatibility with different power sources, increasing the product's versatility.

No. of Terminals: 24

The 24 terminals provide sufficient connectivity options for interfacing with external components and peripherals.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style helps in reducing the overall footprint of the product on the PCB and enables compact designs.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement of 3V allows for operation in low power scenarios and enhances energy efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide temperature range (-40 to 85 °C) allows for operation in extreme temperature conditions, making the product suitable for industrial use.

ADC Channels: YES

The presence of ADC channels enables the product to interface with analog sensors and signals, expanding its applicability in diverse applications.

Terminal Position: DUAL

The dual terminal position offers flexibility in PCB layout and provides multiple options for connecting external components.

ROM Words: 4096

The 4096 ROM words provide ample memory for storing program instructions and data, allowing for complex algorithms and applications to be implemented.

Width: 5.4 mm

The compact width of 5.4 mm facilitates space-efficient PCB designs and integration into small form factor products.

Length: 12.5 mm

The moderate length of 12.5 mm strikes a balance between compactness and accessibility, making the product suitable for various applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures reliable operation in demanding industrial environments, enhancing the product's durability and performance.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, the product integrates multiple functions in a single chip, simplifying system design and reducing component count.

RAM Bytes: 256

The 256 RAM bytes provide temporary storage for data and variables, facilitating efficient execution of programs and algorithms.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and reliable electrical connections, ensuring stability and durability in operation.

Maximum Supply Current: 11.2 mA

The low maximum supply current requirement of 11.2 mA helps in minimizing power consumption and extending battery life in portable applications.

PWM Channels: YES

The presence of PWM channels enables precise control of analog signals, making the product suitable for applications requiring variable speed or intensity control.

ROM Programmability: MROM

The MROM programmability allows for permanent storage of program instructions, ensuring data integrity and reliability in long-term operation.

Terminal Pitch: 1 mm

The fine terminal pitch of 1 mm offers high-density packaging and efficient use of PCB real estate, enabling the product to be used in compact designs.

Speed: 24.4 rpm

The operational speed of 24.4 rpm enables fast and efficient execution of instructions, making the product suitable for real-time control applications.

No. of I/O Lines: 19

The 19 I/O lines provide connectivity for interfacing with external devices and peripherals, allowing for versatile system integration and functionality.

Technical Specifications

Microcontrollers LC872G04A(MFP24S) attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

Length:

12.5 mm

No. of I/O Lines:

19

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP24,.3,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

4096

ROM Programmability:

MROM

Speed:

24.4 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Width:

5.4 mm

Peripheral IC Type:

Trade Compliance

LC872G04A(MFP24S) Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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