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LC872G06A(SSOP24)

Onsemi

LC872G06A(SSOP24) by Onsemi

LC872G06A by Onsemi is an 8-bit microcontroller with 24 terminals, operating at a speed of 24.4 rpm. It features 256 bytes of RAM, 6144 ROM words, and PWM channels for industrial applications requiring a small outline package with shrink pitch technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,411 parts In-Stock

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Vyrian

USA . 648 parts In-Stock

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648

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Problanco Electronics

Mexico . 7,023 parts In-Stock

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7,023

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SupplyDigital Components

Austria . 6,900 parts In-Stock

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6,900

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TANS Electronics

Latvia . 5,295 parts In-Stock

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Kulean Microsystems

USA . 5,114 parts In-Stock

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Corphita

USA . 2,232 parts In-Stock

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UHIMA Technologies

Türkiye . 795 parts In-Stock

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795

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Corohmni

South Africa . 185 parts In-Stock

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Overview

Unlock endless possibilities with the LC872G06A(SSOP24) microcontroller from Onsemi. With its advanced technology and top-notch quality, this versatile device is perfect for a wide range of applications. From industrial automation to consumer electronics, this microcontroller offers unmatched performance and reliability. Experience seamless integration and maximum efficiency with the LC872G06A(SSOP24) by Onsemi. Elevate your projects to the next level with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the components inside, ensuring the durability and reliability of the microcontroller.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly of the microcontroller onto circuit boards.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options for the microcontroller.

Bit Size: 8

An 8-bit microcontroller offers a good balance between complexity and cost, suitable for a wide range of applications.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and signals, expanding its capabilities.

ROM Words: 6144

With a large ROM capacity, the microcontroller can store complex algorithms, programs, and data for efficient processing.

RAM Bytes: 256

A decent amount of RAM allows the microcontroller to work with data and variables efficiently during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Speed: 24.4 rpm

The speed of 24.4 rpm allows for quick processing and response times in various applications.

No. of I/O Lines: 19

Having 19 I/O lines provides flexibility for interfacing with external devices and peripherals, enhancing the microcontroller's functionality.

Technical Specifications

Microcontrollers LC872G06A(SSOP24) attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

Length:

6.5 mm

No. of I/O Lines:

19

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

6144

ROM Programmability:

MROM

Speed:

24.4 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

LC872G06A(SSOP24) Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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