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LC871HC4A

Onsemi

LC871HC4A by Onsemi

The Onsemi LC871HC4A is an 8-bit microcontroller with 131072 ROM words and 12288 RAM bytes. Operating at temperatures from -40 to 85 °C, it's ideal for industrial applications requiring a low power supply of 3/5V. The package style is a flatpack with gull wing terminals, making it suitable for surface mount assembly in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,370 parts In-Stock

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Vyrian

USA . 2,365 parts In-Stock

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Problanco Electronics

Mexico . 4,730 parts In-Stock

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Kulean Microsystems

USA . 4,331 parts In-Stock

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TANS Electronics

Latvia . 4,220 parts In-Stock

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SupplyDigital Components

Austria . 3,188 parts In-Stock

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Corphita

USA . 617 parts In-Stock

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Corohmni

South Africa . 443 parts In-Stock

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UHIMA Technologies

Türkiye . 77 parts In-Stock

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Overview

Unleash the power of innovation with the LC871HC4A by Onsemi. Designed for excellence, this microcontroller is crafted with precision and expertise to deliver unparalleled performance in a wide range of applications. From industrial automation to consumer electronics, this versatile device offers unmatched reliability and efficiency. With Onsemi's reputation for quality and cutting-edge technology, you can trust that the LC871HC4A will exceed your expectations. Experience the next level of control and functionality with this exceptional product, where value meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material ensures durability and protection for the microcontroller, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on electronic circuit boards, saving time and effort in the assembly process.

Bit Size: 8

With an 8-bit size, this microcontroller is suitable for simpler applications that do not require a higher bit size, making it cost-effective for such projects.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies provides flexibility in designing and integrating this microcontroller into different systems and devices.

No. of Terminals: 48

Having 48 terminals allows for connection to various external components and peripherals, expanding the capabilities and functionality of the microcontroller.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller can withstand higher temperature environments, increasing its suitability for industrial applications.

ROM Words: 131072

The large ROM storage capacity of 131072 words enables storing a significant amount of program data and instructions, making it suitable for complex applications that require extensive programming.

RAM Bytes: 12288

The ample RAM capacity of 12288 bytes allows for efficient data storage and processing, enhancing the performance and speed of the microcontroller in executing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving the overall efficiency and reliability of the microcontroller in operation.

Maximum Supply Current: 35 mA

The maximum supply current of 35 mA indicates that this microcontroller is energy-efficient and does not draw excessive power during operation, helping to prolong battery life in portable devices.

Technical Specifications

Microcontrollers LC871HC4A attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

Bit Size:

8

JESD-30 Code:

S-PQFP-G48

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

131072

ROM Programmability:

MROM

Speed:

12 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

35 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

LC871HC4A Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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