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LC872G08A(SSOP24)

Onsemi

LC872G08A(SSOP24) by Onsemi

LC872G08A(SSOP24) by Onsemi is an 8-bit microcontroller with 24 terminals, operating at a speed of 24.4 rpm. It features 256 bytes of RAM and 8192 ROM words, suitable for industrial applications requiring PWM channels and ADC functionality. With a package size of 4.4mm x 6.5mm, it offers a wide temperature range from -40 °C to 85°C for versatile use in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,988 parts In-Stock

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Vyrian

USA . 1,004 parts In-Stock

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Problanco Electronics

Mexico . 7,606 parts In-Stock

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SupplyDigital Components

Austria . 5,888 parts In-Stock

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Kulean Microsystems

USA . 4,876 parts In-Stock

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TANS Electronics

Latvia . 2,512 parts In-Stock

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Corphita

USA . 1,117 parts In-Stock

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UHIMA Technologies

Türkiye . 232 parts In-Stock

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Corohmni

South Africa . 53 parts In-Stock

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Overview

Enhance your electronic projects with the LC872G08A(SSOP24) microcontroller by Onsemi. Crafted with precision and expertise, this versatile device offers endless possibilities for innovation in various applications. From smart home automation to robotics, this powerful microcontroller delivers top-notch performance and reliability. With its compact design and advanced features, the LC872G08A(SSOP24) ensures seamless integration and optimal functionality. Upgrade your projects today with this exceptional product from Onsemi and unlock a world of opportunities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Surface mount technology simplifies the manufacturing process and saves space on the PCB.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage allows for flexibility in power supply options.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to handle during assembly.

Bit Size: 8

8-bit processor provides sufficient processing power for many embedded applications.

Power Supplies (V): 2/5

Multiple power supply options allow for versatile system design.

No. of Terminals: 24

Sufficient number of terminals for connecting various peripherals and components.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline package with shrink pitch saves space on the PCB and enhances thermal performance.

Minimum Supply Voltage: 3 V

Low minimum supply voltage enables operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes the microcontroller suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation in extreme environmental conditions.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and devices.

Terminal Position: DUAL

Dual terminal position allows for flexible PCB layout and efficient signal routing.

ROM Words: 8192

Ample ROM memory capacity for storing program instructions and data.

Width: 4.4 mm

Narrow width saves space on the PCB and allows for compact designs.

Length: 6.5 mm

Compact length facilitates space-efficient PCB layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER

Dedicated microcontroller peripheral IC type provides advanced control and processing capabilities.

RAM Bytes: 256

Adequate RAM capacity for data storage and manipulation during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and PCB assembly.

Maximum Supply Current: 11.2 mA

Low maximum supply current consumption for energy-efficient operation.

PWM Channels: YES

Pulse-width modulation channels enable precise control of analog devices and motors.

ROM Programmability: MROM

Mask ROM (MROM) programmability ensures secure and reliable program storage.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the PCB.

Speed: 24.4 rpm

High speed capability for fast data processing and real-time control applications.

No. of I/O Lines: 19

Sufficient number of input/output lines for connecting external peripherals and devices.

Technical Specifications

Microcontrollers LC872G08A(SSOP24) attributes and parameters. Explore more Microcontrollers devices from Onsemi

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G24

Length:

6.5 mm

No. of I/O Lines:

19

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2/5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

MROM

Speed:

24.4 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

11.2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

LC872G08A(SSOP24) Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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