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FJA4313RTU

Onsemi

FJA4313RTU by Onsemi

FJA4313RTU by Onsemi is a NPN Power BJT with 250V VCE, 17A IC, and 130W Ptot. Ideal for amplifier applications, it has hFE of 55, fT of 30MHz, and operates up to 150 °C. Package: PLASTIC/EPOXY RECTANGULAR with THROUGH-HOLE terminals in FLANGE MOUNT style.

Median Price

$1.313

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,820 parts In-Stock

1+ parts

-

100+ parts

$1.260

1k+ parts

$1.050

10k+ parts

$0.932

3,820

-

$1.260

$1.050

$0.932

DigiKey

USA . 3,820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.580

10k+ parts

-

3,820

-

-

$1.580

-

Verical

USA . 3,820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.313

10k+ parts

$1.165

3,820

-

-

$1.313

$1.165

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,721 parts In-Stock

1+ parts

$0.848

100+ parts

-

1k+ parts

-

10k+ parts

-

1,721

$0.848

-

-

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Digiode

USA . 2,602 parts In-Stock

1+ parts

$0.978

100+ parts

-

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2,602

$0.978

-

-

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DigiKey Marketplace

USA . 4,558 parts In-Stock

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4,558

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Distributors (Availability)

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Corohmni

South Africa . 132 parts In-Stock

1+ parts

$0.848

100+ parts

-

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-

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132

$0.848

-

-

-

Corphita

USA . 833 parts In-Stock

1+ parts

$0.927

100+ parts

-

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-

10k+ parts

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833

$0.927

-

-

-

Component Stockers USA

USA . 2,816 parts In-Stock

1+ parts

$1.050

100+ parts

$0.990

1k+ parts

$0.900

10k+ parts

-

2,816

$1.050

$0.990

$0.900

-

Microchip USA

USA . 9,299 parts In-Stock

1+ parts

$6.435

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9,299

$6.435

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Problanco Electronics

Mexico . 7,482 parts In-Stock

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7,482

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SupplyDigital Components

Austria . 4,674 parts In-Stock

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4,674

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Continental Prestige Electronics

USA . 4,558 parts In-Stock

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100+ parts

$0.930

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4,558

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$0.930

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Kulean Microsystems

USA . 3,976 parts In-Stock

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3,976

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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QUARKTWIN TECHNOLOGY LTD

USA . 3,533 parts In-Stock

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3,533

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Northwest PG Solutions

USA . 2,054 parts In-Stock

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2,054

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TANS Electronics

Latvia . 1,918 parts In-Stock

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1,918

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Native Components

USA . 716 parts In-Stock

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716

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UHIMA Technologies

Türkiye . 685 parts In-Stock

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685

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Supply Digital

USA . 219 parts In-Stock

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219

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Overview

Unleash the power of innovation with the FJA4313RTU by Onsemi, a top-of-the-line Power Bipolar Junction Transistor that promises unparalleled performance and reliability. Manufactured by industry leader Onsemi, this NPN transistor is perfect for amplifier applications, offering a maximum power dissipation of 130W and a maximum collector-emitter voltage of 250V. With a minimum DC current gain of 55 and a nominal transition frequency of 30MHz, this transistor ensures optimal functionality and efficiency. Elevate your projects to new heights with the FJA4313RTU's cutting-edge technology and superior quality, setting you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package offers durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: NPN

NPN transistors are widely used in amplification circuits, making this transistor suitable for amplifier applications.

Configuration: SINGLE

The single configuration simplifies circuit design and makes the transistor easy to use in different amplifier setups.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance in amplification circuits.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and placement within electronic devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection in circuit boards, enhancing the transistor's overall performance.

No. of Terminals: 3

Having 3 terminals allows for easy integration into circuit designs and ensures compatibility with standard amplifier layouts.

Maximum Power Dissipation (Abs): 130 W

With a high maximum power dissipation, this transistor can handle large amounts of power while maintaining efficiency.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides stability and ease of installation in electronic systems.

Minimum DC Current Gain (hFE): 55

The minimum DC current gain ensures consistent and reliable amplification performance in various applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the transistor to withstand harsh environmental conditions and extended use.

Maximum Collector-Emitter Voltage: 250 V

The high maximum collector-emitter voltage rating makes this transistor suitable for applications requiring high voltage amplification.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability, making this product a durable and long-lasting choice.

Maximum Collector Current (IC): 17 A

With a high maximum collector current, this transistor can handle large currents, making it ideal for power amplifier applications.

Terminal Finish: TIN

The tin terminal finish ensures good conductivity and solderability, improving the overall performance and reliability of the transistor.

Terminal Position: SINGLE

Having a single terminal position simplifies the installation process and ensures a secure connection in circuit designs.

Nominal Transition Frequency (fT): 30 MHz

The high nominal transition frequency indicates fast switching speeds and excellent high-frequency performance, making this transistor suitable for high-speed applications.

Technical Specifications

Power Bipolar Junction Transistors (BJT) FJA4313RTU attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

250 V

Configuration:

Minimum DC Current Gain (hFE):

55

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

FJA4313RTU Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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