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FGPF4533TU

Onsemi

FGPF4533TU by Onsemi

FGPF4533TU by Onsemi is an N-CHANNEL IGBT transistor with a max collector-emitter voltage of 330V. It has a nominal turn-off time of 319ns and turn-on time of 30ns, making it ideal for power control applications. The transistor comes in a rectangular package style with through-hole terminals and can operate at temperatures up to 150 °C.

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1k+

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Vyrian

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Digiode

USA . 1,427 parts In-Stock

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Native Components

USA . 337 parts In-Stock

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$6.238

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Problanco Electronics

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TANS Electronics

Latvia . 6,486 parts In-Stock

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Kulean Microsystems

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SupplyDigital Components

Austria . 4,406 parts In-Stock

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Corphita

USA . 3,199 parts In-Stock

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Northwest PG Solutions

USA . 1,786 parts In-Stock

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Supply Digital

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Corohmni

South Africa . 395 parts In-Stock

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UHIMA Technologies

Türkiye . 367 parts In-Stock

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Overview

Unlock the power of precise and efficient power control with the Onsemi FGPF4533TU Insulated Gate Bipolar Transistor (IGBT). Manufactured by industry leader Onsemi, this N-CHANNEL transistor offers unparalleled quality and reliability. Ideal for a wide range of applications, from industrial to automotive, this single-configured IGBT provides customers with exceptional value and performance. Say goodbye to power inefficiencies and hello to optimized power control with the FGPF4533TU by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, ensuring reliable performance and durability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher current-carrying capability, making them suitable for power control applications.

Configuration: SINGLE

Simplifies circuit design and makes the transistor easier to use in various applications.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance in such scenarios.

Package Shape: RECTANGULAR

Rectangular shape allows for compact and efficient mounting on PCBs or other surfaces.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and ease of soldering for secure connections.

Nominal Turn Off Time (toff): 319 ns

Fast turn-off time ensures efficient switching performance, reducing power losses and improving overall efficiency.

No. of Terminals: 3

Provides necessary connections for power control applications while keeping the design simple and compact.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for easy and secure mounting on various surfaces, ensuring reliable operation in different environments.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures, providing thermal stability and reliability in demanding conditions.

Maximum Collector-Emitter Voltage: 330 V

Can handle high voltage levels, making it suitable for power control applications that require high voltage switching.

Transistor Element Material: SILICON

Silicon material offers high performance and reliability in power control applications, ensuring long-term operation.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection, making it easier to integrate into different circuit designs.

Case Connection: ISOLATED

Isolated case connection enhances safety and reliability by preventing electrical interference and ensuring proper insulation.

Nominal Turn On Time (ton): 30 ns

Fast turn-on time allows for quick switching and efficient power control, improving overall performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGPF4533TU attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

330 V

Configuration:

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

319 ns

Nominal Turn On Time (ton):

30 ns

Trade Compliance

FGPF4533TU Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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