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FGPF70N33BTTU

Onsemi

FGPF70N33BTTU by Onsemi

FGPF70N33BTTU by Onsemi is an N-CHANNEL IGBT with 70A IC, 330V VCE, and 48W Pd. It has a toff of 316ns and ton of 41ns, ideal for power control applications. The transistor operates b/w -55 °C to 150°C in a FLANGE MOUNT package style.

Median Price

$1.252

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 450 parts In-Stock

1+ parts

$2.006

100+ parts

$1.825

1k+ parts

$1.645

10k+ parts

-

450

$2.006

$1.825

$1.645

-

Rochester

USA . 3,950 parts In-Stock

1+ parts

-

100+ parts

$1.230

1k+ parts

$1.020

10k+ parts

$0.910

3,950

-

$1.230

$1.020

$0.910

DigiKey

USA . 3,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.050

10k+ parts

-

3,950

-

-

$1.050

-

Verical

USA . 3,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.275

10k+ parts

$1.138

3,950

-

-

$1.275

$1.138

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 528 parts In-Stock

1+ parts

$0.833

100+ parts

-

1k+ parts

-

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528

$0.833

-

-

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Digiode

USA . 1,959 parts In-Stock

1+ parts

$0.960

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-

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-

10k+ parts

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1,959

$0.960

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-

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DigiKey Marketplace

USA . 3,950 parts In-Stock

1+ parts

-

100+ parts

$1.050

1k+ parts

-

10k+ parts

-

3,950

-

$1.050

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 320 parts In-Stock

1+ parts

$0.833

100+ parts

-

1k+ parts

-

10k+ parts

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320

$0.833

-

-

-

Corphita

USA . 1,024 parts In-Stock

1+ parts

$0.909

100+ parts

-

1k+ parts

-

10k+ parts

-

1,024

$0.909

-

-

-

Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$2.006

100+ parts

$1.825

1k+ parts

$1.645

10k+ parts

-

450

$2.006

$1.825

$1.645

-

Microchip USA

USA . 302 parts In-Stock

1+ parts

$6.305

100+ parts

-

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302

$6.305

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SupplyDigital Components

Austria . 5,721 parts In-Stock

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5,721

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Kulean Microsystems

USA . 5,466 parts In-Stock

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5,466

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Problanco Electronics

Mexico . 5,063 parts In-Stock

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5,063

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TANS Electronics

Latvia . 4,094 parts In-Stock

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4,094

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Continental Prestige Electronics

USA . 3,950 parts In-Stock

1+ parts

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$1.210

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3,950

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$1.210

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Supply Digital

USA . 1,487 parts In-Stock

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1,487

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Northwest PG Solutions

USA . 783 parts In-Stock

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783

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Native Components

USA . 338 parts In-Stock

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338

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UHIMA Technologies

Türkiye . 277 parts In-Stock

1+ parts

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277

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Overview

Unleash the power of your electronics with the FGPF70N33BTTU by Onsemi! Crafted with precision and expertise, this Insulated Gate Bipolar Transistor (IGBT) offers unparalleled performance in power control applications. With a maximum collector current of 70 A and an operating temperature range from -55 °C to 150°C, this N-CHANNEL transistor is designed to meet your most demanding needs. Whether you're a hobbyist or a professional, this high-quality component provides exceptional value, reliability, and efficiency. Elevate your projects with the FGPF70N33BTTU today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties and durability, making the product suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower conduction losses and higher efficiency compared to P-channel IGBTs, making them ideal for power control applications.

Configuration: SINGLE

Simplifies circuit design and makes the product easy to integrate into various systems.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring reliable and efficient performance.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and heat dissipation, improving overall product performance.

Nominal Turn Off Time (toff): 316 ns

Fast turn-off time results in lower switching losses and improved efficiency in power control applications.

Maximum Power Dissipation (Abs): 48 W

High maximum power dissipation allows the product to handle heavy loads and operate reliably under high power conditions.

Package Style (Meter): FLANGE MOUNT

Flange mount package style enables secure and stable mounting, enhancing the product's durability and reliability.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures the product can withstand harsh environments and high temperature conditions.

Maximum Collector-Emitter Voltage: 330 V

High maximum collector-emitter voltage rating makes the product suitable for high voltage applications.

Transistor Element Material: SILICON

Silicon material offers good thermal conductivity and reliability, contributing to the product's overall performance and longevity.

Maximum Gate-Emitter Voltage: 30 V

High maximum gate-emitter voltage rating ensures stable operation and protection against voltage spikes.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows the product to function effectively in cold environments.

Maximum Collector Current (IC): 70 A

High maximum collector current rating enables the product to handle heavy current loads without overheating.

Maximum Gate-Emitter Threshold Voltage: 4.3 V

Optimal gate-emitter threshold voltage ensures precise control and efficient switching of the transistor.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection, making the product user-friendly and easy to integrate.

Case Connection: ISOLATED

Isolated case connection improves safety and prevents electrical interference, enhancing the product's overall reliability.

Nominal Turn On Time (ton): 41 ns

Fast turn-on time allows for quick response and precise control in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGPF70N33BTTU attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

330 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

4.3 V

Maximum Gate-Emitter Voltage:

30 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

316 ns

Nominal Turn On Time (ton):

41 ns

Trade Compliance

FGPF70N33BTTU Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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