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FGH4L50T65SQD

Onsemi

FGH4L50T65SQD by Onsemi

FGH4L50T65SQD by Onsemi is an N-CHANNEL IGBT transistor with a max VCEsat of 2.1V and a max IC of 80A. It is designed for power control applications, featuring a nominal toff of 169.6ns and ton of 44.8ns, operating at temperatures ranging from -55°C to 175°C.

Median Price

$4.500

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,340 parts In-Stock

1+ parts

$4.500

100+ parts

$2.700

1k+ parts

$2.610

10k+ parts

-

1,340

$4.500

$2.700

$2.610

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DigiKey

USA . 102 parts In-Stock

1+ parts

$4.500

100+ parts

$3.102

1k+ parts

$2.620

10k+ parts

$2.476

102

$4.500

$3.102

$2.620

$2.476

Chip1Stop

Japan . 280 parts In-Stock

1+ parts

$16.000

100+ parts

$6.570

1k+ parts

-

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280

$16.000

$6.570

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Verical

USA . 450 parts In-Stock

1+ parts

-

100+ parts

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$3.716

10k+ parts

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450

-

-

$3.716

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RS (Exports)

UK . 440 parts In-Stock

1+ parts

-

100+ parts

$4.250

1k+ parts

-

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440

-

$4.250

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,392 parts In-Stock

1+ parts

$4.426

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-

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2,392

$4.426

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Vyrian

USA . 12,399 parts In-Stock

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12,399

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NAC Semi

USA . 900 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.110

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-

900

-

-

$3.110

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IBS Electronics

USA . 450 parts In-Stock

1+ parts

-

100+ parts

$2.912

1k+ parts

$2.808

10k+ parts

$2.756

450

-

$2.912

$2.808

$2.756

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 328 parts In-Stock

1+ parts

$0.297

100+ parts

-

1k+ parts

-

10k+ parts

$0.285

328

$0.297

-

-

$0.285

Northwest PG Solutions

USA . 816 parts In-Stock

1+ parts

$0.327

100+ parts

-

1k+ parts

-

10k+ parts

$0.288

816

$0.327

-

-

$0.288

Corohmni

South Africa . 128 parts In-Stock

1+ parts

$3.060

100+ parts

-

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128

$3.060

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Continental Prestige Electronics

USA . 447 parts In-Stock

1+ parts

$4.130

100+ parts

$2.580

1k+ parts

$2.260

10k+ parts

-

447

$4.130

$2.580

$2.260

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Corphita

USA . 1,252 parts In-Stock

1+ parts

$4.193

100+ parts

-

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1,252

$4.193

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Kulean Microsystems

USA . 7,919 parts In-Stock

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7,919

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Problanco Electronics

Mexico . 6,607 parts In-Stock

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6,607

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TANS Electronics

Latvia . 2,634 parts In-Stock

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2,634

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SupplyDigital Components

Austria . 2,224 parts In-Stock

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2,224

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UHIMA Technologies

Türkiye . 987 parts In-Stock

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987

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Overview

Unleash the power of innovation with the FGH4L50T65SQD by Onsemi. Crafted with precision and expertise, this insulated gate bipolar transistor is designed for superior performance in power control applications. With a maximum collector-emitter voltage of 650V and a built-in diode, this N-channel transistor offers reliability and efficiency like no other. Whether you're looking to optimize power management or enhance system performance, the FGH4L50T65SQD is your ultimate solution. Elevate your projects with Onsemi's cutting-edge technology and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power control and operation in various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and provides added functionality with the built-in diode.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring reliable and efficient performance.

Maximum VCEsat: 2.1 V

Low VCEsat reduces power losses, leading to higher efficiency in power control.

Terminal Form: THROUGH-HOLE

Easy and secure mounting on circuit boards for convenient installation.

Maximum Power Dissipation (Abs): 268 W

High power dissipation capability allows for handling high power levels without overheating.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without performance degradation, suitable for demanding environments.

Maximum Collector-Emitter Voltage: 650 V

High voltage rating allows for use in a wide range of power control applications.

Maximum Collector Current (IC): 80 A

High collector current capability enables handling high current loads with ease.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH4L50T65SQD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

No. of Elements:

1

No. of Terminals:

4

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

169.6 ns

Nominal Turn On Time (ton):

44.8 ns

Maximum VCEsat:

2.1 V

Trade Compliance

FGH4L50T65SQD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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