Loading...

FGH20N60SFDTU-F085

Onsemi

FGH20N60SFDTU-F085 by Onsemi

FGH20N60SFDTU-F085 by Onsemi is an N-CHANNEL IGBT with 600V VCEsat, 40A IC, and 165W power dissipation. Ideal for power control applications, it features a built-in diode, 48ns fall time, and -55 to 150 °C operating temperature range.

Median Price

$2.880

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 251 parts In-Stock

1+ parts

$2.880

100+ parts

$2.820

1k+ parts

$2.760

10k+ parts

-

251

$2.880

$2.820

$2.760

-

Flip Electronics (Authorized)

USA . 450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

450

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,074 parts In-Stock

1+ parts

$2.736

100+ parts

-

1k+ parts

-

10k+ parts

-

1,074

$2.736

-

-

-

Vyrian

USA . 4,017 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,017

-

-

-

-

Flip Electronics

USA . 450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

450

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,781 parts In-Stock

1+ parts

$2.592

100+ parts

-

1k+ parts

-

10k+ parts

-

2,781

$2.592

-

-

-

Corohmni

South Africa . 431 parts In-Stock

1+ parts

$2.880

100+ parts

-

1k+ parts

-

10k+ parts

-

431

$2.880

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 26,605 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,605

-

-

-

-

Problanco Electronics

Mexico . 13,435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,435

-

-

-

-

Kulean Microsystems

USA . 10,327 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,327

-

-

-

-

SupplyDigital Components

Austria . 7,191 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,191

-

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

Northwest PG Solutions

USA . 4,299 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.293

10k+ parts

-

4,299

-

-

$3.293

-

TANS Electronics

Latvia . 2,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,900

-

-

-

-

Native Components

USA . 1,131 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.260

10k+ parts

-

1,131

-

-

$3.260

-

Supply Digital

USA . 938 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

938

-

-

-

-

UHIMA Technologies

Türkiye . 785 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

785

-

-

-

-

GreenTree Electronics

Israel . 450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

450

-

-

-

-

Overview

Enhance your power control applications with the FGH20N60SFDTU-F085 by Onsemi. As a leading manufacturer in insulated gate bipolar transistors, Onsemi delivers top-notch quality and reliability. Designed for single-channel use with a built-in diode, this transistor offers a maximum collector-emitter voltage of 600V and a maximum power dissipation of 165W. With a nominal turn-off time of 110ns and a maximum fall time of 48ns, this transistor ensures efficient performance. Trust Onsemi to provide you with the best solutions for your power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the IGBT, ensuring durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

Enhances efficiency and performance of the IGBT by allowing for better control of current flow.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the IGBT package for power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance in regulating and controlling power flow.

Maximum VCEsat: 2.8 V

Low VCEsat value indicates minimal power loss and high efficiency during operation.

Package Shape: RECTANGULAR

Rectangular shape offers ease of mounting and compatibility with existing systems and designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering for installation.

Maximum Fall Time (tf): 48 ns

Fast fall time ensures quick turn-off of the IGBT, reducing switching losses and improving overall efficiency.

Nominal Turn Off Time (toff): 110 ns

Low turn-off time enhances the switching speed of the IGBT, critical for high-power applications.

No. of Terminals: 3

Optimal number of terminals for necessary connections and control circuits.

Maximum Power Dissipation (Abs): 165 W

High power dissipation capability allows the IGBT to handle large power loads effectively.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides a secure and stable mounting option in various applications.

Maximum Operating Temperature: 150 °C

Wide operating temperature range ensures performance and reliability in various temperature conditions.

Maximum Collector-Emitter Voltage: 600 V

High VCE voltage rating enables the IGBT to handle high voltage levels safely and efficiently.

Transistor Element Material: SILICON

Silicon material offers excellent electrical properties and reliability for high-power applications.

Maximum Gate-Emitter Voltage: 20 V

Sufficient gate-emitter voltage for reliable and precise control of the IGBT during operation.

Minimum Operating Temperature: -55 °C

Can withstand low temperatures, ensuring reliable operation in cold environments.

Maximum Collector Current (IC): 40 A

High collector current rating allows the IGBT to handle large current flows without overheating or damage.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

Appropriate gate-emitter threshold voltage for reliable turn-on and turn-off operation.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance for terminal connections.

Terminal Position: SINGLE

Single terminal position simplifies connection and control of the IGBT within the circuit.

Case Connection: COLLECTOR

Collector case connection allows for efficient heat dissipation and circuit design flexibility.

Nominal Turn On Time (ton): 31 ns

Fast turn-on time ensures quick activation of the IGBT for efficient power control.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 standards ensures reliability and quality for automotive electronic applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH20N60SFDTU-F085 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

RC-IGBT

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Fall Time (tf):

48 ns

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

110 ns

Nominal Turn On Time (ton):

31 ns

Maximum VCEsat:

2.8 V

Trade Compliance

FGH20N60SFDTU-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 12